Company Details

  • Suzhou Sail Science & Technology Co., Ltd.

  •  [Jiangsu,China]
  • Business Type:Manufacturer
  • Main Mark: Americas , Asia , Europe , North Europe , Worldwide
  • Exporter:51% - 60%
  • Certs:ISO9001
  • Description:CNC Diamond Grinding Wheel,Back Side Chipping,Dicing Saw For For Cutting Wlcsp,Dicing Saw For For Cutting Qfn,Dicing Saw For For Cutting Bga
Inquiry Basket ( 0 )

Suzhou Sail Science & Technology Co., Ltd.

CNC Diamond Grinding Wheel,Back Side Chipping,Dicing Saw For For Cutting Wlcsp,Dicing Saw For For Cutting Qfn,Dicing Saw For For Cutting Bga

Home > Products > Abrasion Wheels > Back Grinding Diamond Wheels

Back Grinding Diamond Wheels

Product categories of Back Grinding Diamond Wheels, we are specialized manufacturers from China, CNC Diamond Grinding Wheel, Back Side Chipping suppliers/factory, wholesale high-quality products of Dicing Saw For For Cutting Wlcsp R & D and manufacturing, we have the perfect after-sales service and technical support. Look forward to your cooperation!
View : List Grid
LED Back Grinding Wheel

Model No. : SD3000

LED Back Grinding Wheel LED Back Grinding WheelS substrate are mainly used for back thinning of sapphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer. Workpiece processed: sapphire epitaxial wafer, silicon wafer, gallium arsenide...

China CNC Diamond Grinding Wheel of with CE
 Click for details
Resin Bonded Grinding Discs

The grinding wheels for LED substrate are mainly used for back thinning of sapphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer. Workpiece processed: sapphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer....

China Manufacturer of Back Side Chipping
 Click for details
Metal Bond Diamond&CBN Grinding Wheel

Metal bond Grinding Wheels Metal Bonded Diamond/CBN Grinding wheel is with high efficiency, good self-sharpening, high stock removal, good form remaining and good anti-wearing ability. Metal bond diamond wheel Used for machining quartz crystal,...

High Quality Dicing Saw For For Cutting Wlcsp China Supplier
 Click for details
Thinning Grinding Wheel

Model No. : 6A2

Vitrified diamond wheels for thinning and finishing of silicon wafer and sapphaire . Quality stability ,Free Cutting. Type:6A2,6A2T Abbrasive :Diamond Bond:Vitrified Features:Sharpening,high efficiency and precision without chipping and...

High Quality Dicing Saw For For Cutting Qfn China Factory
 Click for details
Grinding Wheel For Back Thinning

Model No. : SD3500

Advantage: Minimized wafer edge chipping/improved die strength,Excellent grinding ablity with high feed/Applicable thin wafer Sail series grinding wheels employ a new porous vitrified bond with excellent swarf removal capability as well, the new...

China Supplier of Dicing Saw For For Cutting Bga
 Click for details
Diamond Milling Grinding Wheel For Optical Glass

Model No. : SD3000

Product Description Diamond back grinding wheels for LED substrate are mainly used for back thinning of sapphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer. This kind of grinding wheel developed in out company can replace foreign...

China Factory of CNC Diamond Grinding Wheel
 Click for details
Back Grinding Wheel(LED)

Model No. : SD1000

Advantage: Minimized wafer edge chipping/improved die strength,Excellent grinding ablity with high feed/Applicable thin wafer Sail series grinding wheels employ a new porous vitrified bond with excellent swarf removal capability as well, the new...

Back Side Chipping Made in China
 Click for details
Back Grinding Wheel for Silicon Wafer

Model No. : SD1000

MS series grinding wheels employ a new porous vitrified bond with excellent swarf removal capability as well, the new bond feeds in the wheel coolant water in order to grind extremely hard SiC wafers. Grinding with a fixed abrasive produces a...

Professional Manufacturer of Dicing Saw For For Cutting Wlcsp
 Click for details
MS series grinding wheel

MS series grinding wheels employ a new porous vitrified bond with excellent swarf removal capability as well, the new bond feeds in the wheel coolant water in order to grind extremely hard SiC wafers. Grinding with a fixed abrasive produces a...

Leading Manufacturer of Dicing Saw For For Cutting Qfn
 Click for details
Silicon Wafer back & front wheel

Model No. : SW01

Silicon grinding wheels are mainly used for the thinning and fine grinding of the silicon wafer. These products were produced by our company, which possess superior grinding performance and high cost performance, are among the top level worldwide....

Professional Supplier of Dicing Saw For For Cutting Bga
 Click for details
The grinding wheels for LED substrate

Model No. : SD

The grinding wheels for LED substrate are mainly used for back thinning of sapphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer. Workpiece processed: sapphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer....

 Click for details
Grinding wheels for ceramic ferrule

Vitrified products have the features of sharp cutting, high efficiency, long life, less heat and jam generated in grinding, easy control of the precision and easy dressing. Our institute is able to provide vitrified superabrasive grinding wheels...

 Click for details
Electroplated grinding wheel for Marble and Granite

Product Application Electroplated diamond cutting disc can be used for cutting a wide range of hard and abrasive materials such as marble, granite, ceramic tile, glass, thermosetting plastics, concrete board, GRP, pre-sintered and pre-fired (green)...

 Click for details
The Back Grinding Wheels for GaN Wafer

Specifications 1.be used with Japanese, German, American, Korea and Chinese grinders 2.superior grinding performance 3.high cost performance Shape code Profile Sketch Conventional Specification

 Click for details
Electroplated Diamond Grinding Cup Wheel for Glass

Specifications: 1. Diamond Grinding Cup Wheel 2. Factory. 3. Type: electroplated for glass 4. Grit No.: Course, Medium, Fine Diamond Cup Wheels are designed for grinding and polishing marble, granite, concrete, porcelin tiles, masonry, natural...

 Click for details
Electroplated Grinding Wheel for Magnetic Materials

Specifications Details of diamond electroplated grinding wheel for hard alloy Product Name: Diamond Centerless Grinding Wheel,Resion Diamond Grinding Wheel,Centerless Grinding Wheel,Alloy Grinding Wheel Abrasive: Diamond /CBN Matrial: Aluminium and...

 Click for details
Silicon grinding wheels

Silicon grinding wheels are mainly used for the thinning and fine grinding of the silicon wafer. These products produced by our company,which possess superior grinding performance and high cost performance,are among the top level worldwide. They are...

 Click for details
Electroplated metal bond Diamond / CBN grinding wheel

Packaging & Delivery Packaging Details: cardboard box, or as required Delivery Detail: 3-4 weeks, we aim to despatch your order within 15 working days Specifications 1.Electroplated metal bond 2.High-concention 3.Sharp-cutting 4.High processing...

 Click for details
1A1 Flat Shape Carbide Back Grinding Wheel

Product Description: 1A1 flat resin/metal bond diamond/CBN grinding wheels for tungsten carbide/steel Product details Item name diamond/CBN diamond grinding wheel Type code

 Click for details
China Back Grinding Diamond Wheels Suppliers

Silicon wafer back Grinding Wheels are mainly used for the thinning and fine grinding of the silicon wafer.The workpiece processed: silicon wafer of discrete devices, integrated chips (IC) and virgin, etc. Material of workpiece: monocrystalline silicon and some other Semiconductor Materials.

Application: back thinning, grinding and fine grinding.

*Related Products:Dicing Saw For For Cutting Wlcsp,Dicing Saw For For Cutting Qfn,Dicing Saw For For Cutting Bga.

Communicate with Supplier?Supplier
Lisa Ms. Lisa
What can I do for you?
Contact Supplier