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Back Grinding Diamond Wheels

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LED Back Grinding Wheel
Brand:Sail-tech
Packaging:Bags or Cartons
Certificate:ISO9001:2008
Model No.:SD3000
LED Back Grinding Wheel LED Back Grinding WheelS substrate are mainly used for back thinning of sapphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer. Workpiece processed: sapphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer. Material of workpiece: synthetic sapphire, single...
Resin Bonded Grinding Discs
Brand:SAIL-TECH
Packaging: Carton package for small size wheel Carton+plastic foam for big size wheel
Certificate:ISO9001:2008
The grinding wheels for LED substrate are mainly used for back thinning of sapphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer. Workpiece processed: sapphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer. Material of workpiece: synthetic sapphire, single crystal silicon, gallium...
Metal Bond Diamond&CBN Grinding Wheel
Brand:SAIL-TECH
Packaging:Bags or Cartons
Certificate:ISO9001:2015
Metal bond Grinding Wheels Metal Bonded Diamond/CBN Grinding wheel is with high efficiency, good self-sharpening, high stock removal, good form remaining and good anti-wearing ability. Metal bond diamond wheel Used for machining quartz crystal, tungsten carbide, ceramic, glass, composite, sapphire, ferrite,...
Thinning Grinding Wheel
Brand:SAIL-TECH
Packaging:Bags or Cartons
Certificate:ISO9001:2008
Model No.:6A2
Vitrified diamond wheels for thinning and finishing of silicon wafer and sapphaire . Quality stability ,Free Cutting. Type:6A2,6A2T Abbrasive :Diamond Bond:Vitrified Features:Sharpening,high efficiency and precision without chipping and scratching,reasonable price ,replace the wheels imported. For the Machines:SHUWA...
Grinding Wheel For Back Thinning
Brand:SAIL-TECH
Packaging:Bags or Cartons
Certificate:ISO9001:2008
Model No.:SD3500
Advantage: Minimized wafer edge chipping/improved die strength,Excellent grinding ablity with high feed/Applicable thin wafer Sail series grinding wheels employ a new porous vitrified bond with excellent swarf removal capability as well, the new bond feeds in the wheel coolant water in order to grind extremely hard...
Diamond Milling Grinding Wheel For Optical Glass
Brand:SAIL-TECH
Packaging:Bags or Cartons
Certificate:ISO9001:2008
Model No.:SD3000
Product Description Diamond back grinding wheels for LED substrate are mainly used for back thinning of sapphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer. This kind of grinding wheel developed in out company can replace foreign products. They can be used steadily on Japanese, Korean grinders with...
Back Grinding Wheel for Silicon Wafer
Brand:SAIL-TECH
Packaging:Bags or Cartons
Certificate:ISO9001:2008
Model No.:SD1000
MS series grinding wheels employ a new porous vitrified bond with excellent swarf removal capability as well, the new bond feeds in the wheel coolant water in order to grind extremely hard SiC wafers. Grinding with a fixed abrasive produces a surface roughness approaching a polish. Grinding can be performed on tape...
Back Grinding Wheel(LED)
Brand:SAIL-TECH
Packaging:Bags or Cartons
Certificate:ISO9001:2008
Model No.:SD1000
Advantage: Minimized wafer edge chipping/improved die strength,Excellent grinding ablity with high feed/Applicable thin wafer Sail series grinding wheels employ a new porous vitrified bond with excellent swarf removal capability as well, the new bond feeds in the wheel coolant water in order to grind extremely hard...
MS series grinding wheel
MS series grinding wheels employ a new porous vitrified bond with excellent swarf removal capability as well, the new bond feeds in the wheel coolant water in order to grind extremely hard SiC wafers. Grinding with a fixed abrasive produces a surface roughness approaching a polish. Grinding can be performed on tape...
Silicon Wafer back & front wheel
Brand:SAIL-TECH
Packaging:Bags or Cartons
Certificate:ISO9001:2008
Model No.:SW01
Silicon grinding wheels are mainly used for the thinning and fine grinding of the silicon wafer. These products were produced by our company, which possess superior grinding performance and high cost performance, are among the top level worldwide. They are usually used for back thinning, grinding and fine grinding of...
The grinding wheels for LED substrate
Brand:Sail-tech
Packaging:Bags or Cartons
Certificate:ISO9001:2008
Model No.:SD
The grinding wheels for LED substrate are mainly used for back thinning of sapphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer. Workpiece processed: sapphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer. Material of workpiece: synthetic sapphire, single crystal silicon, gallium...
Grinding wheels for ceramic ferrule
Vitrified products have the features of sharp cutting, high efficiency, long life, less heat and jam generated in grinding, easy control of the precision and easy dressing. Our institute is able to provide vitrified superabrasive grinding wheels according to the standard GB/T6409. Features: Fine grit, standing sharp...
Electroplated grinding wheel for Marble and Granite
Product Application Electroplated diamond cutting disc can be used for cutting a wide range of hard and abrasive materials such as marble, granite, ceramic tile, glass, thermosetting plastics, concrete board, GRP, pre-sintered and pre-fired (green) materials, refractory brick, HPL/Fire-proof...
The Back Grinding Wheels for GaN Wafer
Specifications 1.be used with Japanese, German, American, Korea and Chinese grinders 2.superior grinding performance 3.high cost performance Silicon wafer back grinding wheels are mainly used for the thinning and fine grinding of the silicon wafer. The workpiece processed: silicon wafer of discrete devices, integrated...
Electroplated Diamond Grinding Cup Wheel for Glass
Specifications: 1. Diamond Grinding Cup Wheel 2. Factory. 3. Type: electroplated for glass 4. Grit No.: Course, Medium, Fine Diamond Cup Wheels are designed for grinding and polishing marble, granite, concrete, porcelin tiles, masonry, natural & artificial stone surfaces. Products Description: 1. Diameter:...
Electroplated Grinding Wheel for Magnetic Materials
Specifications Details of diamond electroplated grinding wheel for hard alloy Product Name: Diamond Centerless Grinding Wheel,Resion Diamond Grinding Wheel,Centerless Grinding Wheel,Alloy Grinding Wheel Abrasive: Diamond /CBN Matrial: Aluminium and Steel Bond: Resin,Electroplated ,Vitrified ,Brazed Size: D...
Silicon grinding wheels
Silicon grinding wheels are mainly used for the thinning and fine grinding of the silicon wafer. These products produced by our company,which possess superior grinding performance and high cost performance,are among the top level worldwide. They are usually used for back thinning, grinding and fine grindingof...
Electroplated metal bond Diamond / CBN grinding wheel
Packaging & Delivery Packaging Details: cardboard box, or as required Delivery Detail: 3-4 weeks, we aim to despatch your order within 15 working days Specifications 1.Electroplated metal bond 2.High-concention 3.Sharp-cutting 4.High processing efficient and work piece precision Electroplated metal bond...
1A1 Flat Shape Carbide Back Grinding Wheel
Product Description: 1A1 flat resin/metal bond diamond/CBN grinding wheels for tungsten carbide/steel Product details Brief introduction of tungsten carbide plates/blocks: 1A1 Flat diamond grinding wheels are widely used to grind hard crisp material,such as tungsten carbide carbide, alumina porcelain,optical...
China Back Grinding Diamond Wheels Suppliers

Silicon wafer back Grinding Wheels are mainly used for the thinning and fine grinding of the silicon wafer.The workpiece processed: silicon wafer of discrete devices, integrated chips (IC) and virgin, etc. Material of workpiece: monocrystalline silicon and some other Semiconductor Materials.

Application: back thinning, grinding and fine grinding.

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