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The Back Grinding Wheels for GaN Wafer

Basic Info

Material: Diamond

Abrasive: Superabrasive

Shapes: With Handle

Types: Surface Grinding Wheel

Cylindricity: <0.05

Circular Degree: <0.05

Technics: Sinter

Working Style: Surface Grinding

Product Description


Specifications

1.be used with Japanese, German, American, Korea and Chinese grinders
2.superior grinding performance

3.high cost performance

Shape code

Profile Sketch

Conventional Specification (mm)

Out diameter D

Thickness

T

Hole diameter H

6A2

175

30, 35

76

200

35

76

375

40

127

6A2T

195

22.5, 25

170

280

30

228.6

350

35

235

6A2T-

209

22.5

158

Silicon wafer back Grinding Wheels are mainly used for the thinning and fine grinding of the silicon wafer.

The workpiece processed: silicon wafer of discrete devices, integrated chips (IC) and virgin etc.

Material of workpiece: monocrystalline silicon and some other Semiconductor Materials.

Application: back thinning, grinding and fine grinding.

The grinding wheels for LED substrate are mainly used for back thinning of sapphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer.

Workpiece processed: sapphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer.

Material of workpiece: synthetic sapphire, single crystal silicon, gallium arsenide and GaN materials.

Grinders: SHUWA SGM-6301, NTS Nanosurface-180G, NTS Nanosurface 250/NC-VDM



Contact us if you need more details on The Precision Back Grinding Wheels. We are ready to answer your questions on packaging, logistics, certification or any other aspects about Superior Grinding Performance、The High Shape Preserving. If these products fail to match your need, please contact us and we would like to provide relevant information.

Product Categories : Abrasion Wheels > Back Grinding Diamond Wheels

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