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LED Back Grinding Wheel

Basic Info

Model No.: SD3000

Product Description

LED Back Grinding Wheel

LED Back Grinding WheelS substrate are mainly used for back thinning of sapphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer.
Workpiece processed: sapphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer.
Material of workpiece: synthetic sapphire, single crystal silicon, gallium arsenide and GaN materials.
Grinders: SHUWA SGM-6301, NTS Nanosurface-180G, NTS Nanosurface 250/NC-VDM

485189214_653

6A2T Grinding Wheels

Features:

1.Be used with Japanese, German, American, Korea and Chinese grinders
2.Superior grinding performance
3.High cost performance



Specfication:

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Contact us if you need more details on Back Grinding Wheel for Silicon Wafer. We are ready to answer your questions on packaging, logistics, certification or any other aspects about Backing Grinding Wheel for Edge Chipping、Back Grinding Wheel for Thin Wafer. If these products fail to match your need, please contact us and we would like to provide relevant information.

Product Categories : Abrasion Wheels > Back Grinding Diamond Wheels

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