Find CNC Diamond Grinding Wheel, Back Side Chipping, Dicing Saw For For Cutting Wlcsp on Industry Directory, Reliable Manufacturer/Supplier/Factory from China.

Basic Info

Model No.: SD3000

Type: Die Grinder, M

Power Source: Electricity

Object: Turning Tool

Application: Construction, Rough Grinding

Disc(Wheel) Type: Grinding Disc

Material: Metal

Working Style: High-speed universal

Disc Diameter: 230mm

Variable Speed: With Variable Speed

Bond: Metal

Material Of Workpieces: Sappire

Fetures: Long Life And High Efficiency

Outer Diameter: 200-304mm

Wide Of Layer: 2-7mm

High Of Layer: 5-10

Grit: 270-8000

Product Description

LED Back Grinding Wheel

LED Back Grinding WheelS substrate are mainly used for back thinning of sapphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer.
Workpiece processed: sapphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer.
Material of workpiece: synthetic sapphire, single crystal silicon, gallium arsenide and GaN materials.
Grinders: SHUWA SGM-6301, NTS Nanosurface-180G, NTS Nanosurface 250/NC-VDM


6A2T Grinding Wheels


1.Be used with Japanese, German, American, Korea and Chinese grinders
2.Superior grinding performance
3.High cost performance



Contact us if you need more details on Back Grinding Wheel for Silicon Wafer. We are ready to answer your questions on packaging, logistics, certification or any other aspects about Backing Grinding Wheel for Edge Chipping、Back Grinding Wheel for Thin Wafer. If these products fail to match your need, please contact us and we would like to provide relevant information.

Product Categories : Abrasion Wheels > Back Grinding Diamond Wheels

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