Find CNC Diamond Grinding Wheel, Back Side Chipping, Dicing Saw For For Cutting Wlcsp on Industry Directory, Reliable Manufacturer/Supplier/Factory from China.

Thinning Grinding Wheel

Basic Info

Model No.: 6A2

Product Description

Vitrified diamond wheels for thinning and finishing of silicon wafer and sapphaire .
Quality stability ,Free Cutting.
Type:6A2,6A2T
Abbrasive :Diamond
Bond:Vitrified
Features:Sharpening,high efficiency and precision without chipping and scratching,reasonable price ,replace the wheels imported.
For the Machines:SHUWA SGM-6301,NTS Nano Surface-180G,NTS Nano Surface 250/NC-VDM,WEC.


Advantage:

Minimized wafer edge chipping/improved die strength,Excellent grinding ablity with high feed/Applicable thin wafer

Thinning Grinding Wheel

Sail series Grinding Wheels employ a new porous vitrified bond with excellent swarf removal capability as well, the new bond feeds in the wheel coolant water in order to grind extremely hard SiC wafers. Grinding with a fixed abrasive produces a surface roughness approaching a polish. Grinding can be performed on tape mounted wafers making it unnecessary to use wafer carriers. The total process is much easier compared to a slurry processes

High-Quality-Diamond-Back-Grinding-Wheel-For

Sail series grinding wheels

1. excllent quality.

2, steady working
3. long life time.
4. high performance

Specification:




Contact us if you need more details on Thinning Grinding Wheel. We are ready to answer your questions on packaging, logistics, certification or any other aspects about Thinning or Back Grinding Wheel、Thinning Grinding Wheel. If these products fail to match your need, please contact us and we would like to provide relevant information.

Product Categories : Abrasion Wheels > Back Grinding Diamond Wheels

Email to this supplier
  • *Subject:
  • To:

  • *Messages:
    Your message must be between 20-8000 characters