Company Details

  • Suzhou Sail Science & Technology Co., Ltd.

  •  [Jiangsu,China]
  • Business Type:Manufacturer
  • Main Mark: Americas , Asia , Europe , North Europe , Worldwide
  • Exporter:51% - 60%
  • Certs:ISO9001
  • Description:Thinning Grinding Wheel,Thinning or Back Grinding Wheel
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Suzhou Sail Science & Technology Co., Ltd.

Thinning Grinding Wheel,Thinning or Back Grinding Wheel

Thinning Grinding Wheel

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    Payment Type: T/T
    Incoterm: FOB,CIF,CIP
    Min. Order: 30 Bag/Bags
    Delivery Time: 15 Days

Basic Info

Model No.: 6A2

Type: Die Grinder

Power Source: Electricity

Object: Turning Tool

Application: Construction

Disc(Wheel) Type: Grinding Disc

Material: Metal

Working Style: High-speed universal

Disc Diameter: 230mm

Variable Speed: With Variable Speed

Product Name: Back Drinding Wheel

Applications: Silicon Wafer

Abrasive: SD Synthetic

Grit: 270-8000

Bond: Metal,Vitrified,Resin

OD: 200~304

Width: 2-7MM

Additional Info

Packaging: Bags or Cartons

Productivity:  1200PCS PER MONTH

Brand: SAIL-TECH

Place of Origin:  SUZHOU INDUSTRIAL PARK

Supply Ability: 300PCS PER WEEK

Certificate: ISO9001:2008

HS Code: 8202391000

Port: Shanghai Airport,Shanghai Seaport

Product Description

Vitrified diamond wheels for thinning and finishing of silicon wafer and sapphaire .
Quality stability ,Free Cutting.
Type:6A2,6A2T
Abbrasive :Diamond
Bond:Vitrified
Features:Sharpening,high efficiency and precision without chipping and scratching,reasonable price ,replace the wheels imported.
For the Machines:SHUWA SGM-6301,NTS Nano Surface-180G,NTS Nano Surface 250/NC-VDM,WEC.


Advantage:

Minimized wafer edge chipping/improved die strength,Excellent grinding ablity with high feed/Applicable thin wafer

Thinning Grinding Wheel

Sail series Grinding Wheels employ a new porous vitrified bond with excellent swarf removal capability as well, the new bond feeds in the wheel coolant water in order to grind extremely hard SiC wafers. Grinding with a fixed abrasive produces a surface roughness approaching a polish. Grinding can be performed on tape mounted wafers making it unnecessary to use wafer carriers. The total process is much easier compared to a slurry processes

High-Quality-Diamond-Back-Grinding-Wheel-For

Sail series grinding wheels

1. excllent quality.

2, steady working
3. long life time.
4. high performance

Specification:




Looking for ideal Thinning Grinding Wheel Manufacturer & supplier ? We have a wide selection at great prices to help you get creative. All the Thinning or Back Grinding Wheel are quality guaranteed. We are China Origin Factory of Thinning Grinding Wheel. If you have any question, please feel free to contact us.

Product Categories : Abrasion Wheels > Back Grinding Diamond Wheels

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  • Thinning Grinding Wheel
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