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Thinning Grinding Wheel

Basic Info

Model No.: 6A2

Product Description

Vitrified diamond wheels for thinning and finishing of silicon wafer and sapphaire .
Quality stability ,Free Cutting.
Abbrasive :Diamond
Features:Sharpening,high efficiency and precision without chipping and scratching,reasonable price ,replace the wheels imported.
For the Machines:SHUWA SGM-6301,NTS Nano Surface-180G,NTS Nano Surface 250/NC-VDM,WEC.


Minimized wafer edge chipping/improved die strength,Excellent grinding ablity with high feed/Applicable thin wafer

Thinning Grinding Wheel

Sail series Grinding Wheels employ a new porous vitrified bond with excellent swarf removal capability as well, the new bond feeds in the wheel coolant water in order to grind extremely hard SiC wafers. Grinding with a fixed abrasive produces a surface roughness approaching a polish. Grinding can be performed on tape mounted wafers making it unnecessary to use wafer carriers. The total process is much easier compared to a slurry processes


Sail series grinding wheels

1. excllent quality.

2, steady working
3. long life time.
4. high performance


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Product Categories : Abrasion Wheels > Back Grinding Diamond Wheels

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