Model No.: 6A2
Type: Die Grinder
Power Source: Electricity
Object: Turning Tool
Disc(Wheel) Type: Grinding Disc
Working Style: High-speed universal
Disc Diameter: 230mm
Variable Speed: With Variable Speed
Product Name: Back Drinding Wheel
Applications: Silicon Wafer
Abrasive: SD Synthetic
Vitrified diamond wheels for thinning and finishing of silicon wafer and sapphaire .
Quality stability ,Free Cutting.
Features:Sharpening,high efficiency and precision without chipping and scratching,reasonable price ,replace the wheels imported.
For the Machines:SHUWA SGM-6301,NTS Nano Surface-180G,NTS Nano Surface 250/NC-VDM,WEC.
Minimized wafer edge chipping/improved die strength,Excellent grinding ablity with high feed/Applicable thin wafer
Thinning Grinding Wheel
Sail series Grinding Wheels employ a new porous vitrified bond with excellent swarf removal capability as well, the new bond feeds in the wheel coolant water in order to grind extremely hard SiC wafers. Grinding with a fixed abrasive produces a surface roughness approaching a polish. Grinding can be performed on tape mounted wafers making it unnecessary to use wafer carriers. The total process is much easier compared to a slurry processes
Sail series grinding wheels
1. excllent quality.
2, steady working
3. long life time.
4. high performance