Grinding Metal-bond Wheels
Basic Info
Model No.: SD
Product Description
The Grinding Wheels for LED substrate are mainly used for back thinning of sapphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer.
Workpiece processed: sapphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer.
Material of workpiece: synthetic sapphire, single crystal silicon, gallium arsenide and GaN materials.
Grinders: SHUWA SGM-6301, NTS Nanosurface-180G, NTS Nanosurface 250/NC-VDM
6A2T grinding wheels
Features:
1.Be used with Japanese, German, American, Korea and Chinese grinders
2.Superior grinding performance
3.High cost performance
Specfication:
Contact us if you need more details on Metal-Bond Wheels. We are ready to answer your questions on packaging, logistics, certification or any other aspects about Electroplated Metal-bond Wheels、Grinding Wheels(Metal-bond Wheels). If these products fail to match your need, please contact us and we would like to provide relevant information.
Product Categories : Abrasion Wheels > Back Grinding Diamond Wheels
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