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Metal-Bond Dicing Blade

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Ultra Thin Diamond Discs
Brand:SAIL-TECH
Packaging:Bags/Cartons
Certificate:ISO9001:2008
We produce Ultra Precision diamond and CBN grinding wheel Application: They are suitable for: High-tech electronic parts and related products such as magnetic head, IC, LSI, optical fiber, semiconductor, electronic lead frame and etc, require high precision disc wheel with high precision, efficiency Cutting, Slicing,...
High Precision blade Cutting Sapphire Crystal
Model No.:MS09t2H
The metal sintered ultra thin and precision diamond blade is with the speciality of strong-hold grains and exellent wearability. It fits to be used for the cutting and grooving of electronic and optical materials, also could be used for the cutting and grooving of ceramic and semiconductor materials with its good...
70μm Ultra-thin Diamond Dicing-Blade
Model No.:MR0209D
It is available for the application that is wide from brittle materials such as glass or the Ceramics to semiconductor packages such as CSP or QFN by an abundant bond lineup,especially for WLCSP cutting. In addition, the sharpness and balance of the life provide the product which they got by intensive degree control a...
Ultra-thin Metal-bond Dicing Blade
Packaging:Carton
Model No.:M1A8 SD1000N25MR0207
The metal sintered ultra thin and precision diamond blade is with the speciality of strong-hold grains and exellent wearability. The metal-bond dicing blade fits to be used for the cutting and grooving of electronic and optical materials, also could be used for the cutting and grooving of ceramic and semiconductor...
40μm Ultra Thin Dicing Blade
Model No.:MS09T
-The metal sintered ultra tin and precision diamond blade diamond blade is with the speciality of strong-hold grains and excellend wear-resistance. It fits to be used for the cutting and grooving of electronic and optical materials, Espicially for the Productionof WLP, also could be used for the cutiing and grooving...
Diamond Dicing Saw for cutiing glass
The features of the metal bond products are high efficiency, good self sharpening ,high stock removal ,strong hold and good abrasion resistance,Leading metal blade series for WLCSP cutting , Improved backside chipping and peeling enabled higher-speed cutting. Features: 1. High accuracy 2. Long life span 3. Strong hold...
QFN cutting Sintered Dicing Blade
Realized the cutting of QFN package with metal blades. Cutting quality and performance stability proved by the PLC cutting. The standard bond series represented by a high sintering technology. Features: 1.High sintering technologies bring out the properties to correspond to the various applications. 2.A unique...
1A8 Metal bond diamond dicing saw
A8 Metal bond diamond cutting blade is made from diamond or cubic boron nitride bonded with metal powder through special processes. The blade is mianly used for slotting and cutting with high precision and small kerfs. The specifications are 1A8/1 and 1A8/2. Features: 1.Minimized blade wear and high cutting ability...
High precision Dicing saw
Model No.:MS09J
Ceramics cutting is now shifting from resin to metal.Our unique idea to soften the metal realized "unbending," "strong," and "fast" blade. Features: 1.Metal blade series specialized in the ceramics cutting. 2.Higher rigidity than the resin blade allows better straightness and higher-speed cutting. 3.Higher wear...
Glass cutting Diamond dicing Blade
Model No.:MS07T2
Sintered metal powder is used as the bonding agent material to realize strong holding power. As a result, these blades have low blade wear. These blades are ideal for high precision grooving and cutting of electronics parts or optical devices. Features: 1.Extensive bond lineup can meet the variety of applications...
Diamond Dicing Blade for BGAs
The metal sintered ultra thin and precision diamond blade is with the speciality of strong-hold grains and exellent wearability. It fits to be used for the cutting and grooving of electronic and optical materials, also could be used for the cutting and grooving of ceramic and semiconductor materials with its good...
Diamond ultra thin dicing blade for electircal parts
The feathers of the metal bond products are high good self-sharping, sharp cutting, high efficiencyhigh stock removal, strong hold and good abrasion resistance,Sintered metal powder is used as the bonding agent material to realize strong holding power. As a result, these blades have low blade wear. These blades are...
48μm Ultra-thin metal-bond dicing blade
Model No.:MR0209
Leading metal blade series for WLCSP cutting , Improved backside chipping and peeling enabled higher-speed cutting. Features: 1. High accuracy 2. Long life span 3. Strong hold of grits 4. Slight cutting depth 5. Good wear resistance 6. Good shape keeping ability Cutting conditons SpecificationS Shape Specification...
Wafer cutting Metal bond dicing blades
We have a professional production line for wafer cutting,They are mainly used for grooving and cutting with high accuracy and slight cutting depth,High sintering technologies bring out the properties to correspond to the various applications.A unique manufacturing processes offer the even distribution of the grit and...
Diamond Dicing blades  for optical glass
Superthin superabrasive diamond dicing blades are mainly used for precise cutting and slotting kinds of electronic and precision part in the electronic information and the mechanical fields. It has a series of merits such as high precision, small kerfs, high quality of procrssing surface and son on. with slower wear...
Metal-Bond Diamond Dicing Blade
Metal bond high precision dicing blade without steel core is made of identical material, with thin thickness and high precision, They are mainly used for grooving and cutting with high accuracy and slight cutting depth,High sintering technologies bring out the properties to correspond to the various applications.A...
Metal Sintered Dicing Blades
Superthin superabrasive diamond dicing blades are mainly used for precise cutting and slotting kinds of electronic and precision part in the electronic information and the mechanical fields. It has a series of merits such as high precision, small kerfs, high quality of procrssing surface and son on. with slower wear...
China Metal-Bond Dicing Blade Suppliers

The metal sintered ultra tin and precision Diamond Blade diamond blade is with the speciality of strong-hold grains and excellend wear-resistance. It fits to be used for the cutting and grooving of electronic and optical materials, also could be used for the cutiing and grooving of ceramic and semiconductor material with its good rigidity

*Related Products:Diamond Dicing Saw,Dicing Blade For Cutting Qfn.