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Ultra-thin Metal-bond Dicing Blade

Basic Info

Model No.: M1A8 SD1000N25MR0207

Type: Die Grinder, 1A8,1V8,1E8,1M8

Power Source: Electricity

Object: Saw Blade

Application: Construction

Disc(Wheel) Type: Cutting Disc

Material: Metal

Working Style: High-speed universal

Variable Speed: With Variable Speed

Diamond: SD

Grit: 220 #220,280 #280,320 #320,.....1500 #1500

HARDNESS: N Or L

Concentration: 25%,50%,75%,100% ,125%

Outer Diameter: 52mm-150mm

Thickness: 0.04~1.0mm

Inner Diameter: 12.7~40mm

Product Description

The metal sintered ultra thin and precision Diamond Blade is with the speciality of strong-hold grains and exellent wearability. The Metal-Bond Dicing Blade fits to be used for the cutting and grooving of electronic and optical materials, also could be used for the cutting and grooving of ceramic and Semiconductor Materials with its good rigidity.

Features:

1. Grinding efficiently, good wear resistance,
2.small grinding force, low grinding temperature
3.good quality of processing.
4.best diamond material
5.Used for sharpening, grinding, abrasive

Cutting conditons

Spindle speed 17-20K RPM
Feed Speed 5mm/sec
sapphire crystal
0.3mm


Specifications

Shape

Shape
1A8
Specification


Grit type Grite size Concentration Bond
SD 1000 25 MS09T2H

Grit Type


SD Standard grit
SDC Coating grit

Mesh Size


Mesh size SD SDC
4000 ok
2500 ok

2000 ok

1500 ok

1200 ok
ok
1000 ok
ok
900 ok
ok
800 ok
ok
700 ok
ok
600 ok
ok
500 ok
ok
400 ok
ok
320 ok
ok


Dimension

O.D.
Blade thickness
I.D.
53 0.1 40
D.D.(mm) Blade thickness(mm)
I.D
Availability size Tolerance Availabiility size Tolerance Availabiility size
Tolerance
50-100 +0.05/-0 0.05-0.5 ±0.005 25.4-88.9 H6



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Product Categories : The Blade Series > Metal-Bond Dicing Blade

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