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Basic Info

Type: Die Grinder

Power Source: Electricity

Object: Saw Blade

Application: Construction

Disc(Wheel) Type: Cutting Disc

Material: Metal

Working Style: High-speed universal

Variable Speed: With Variable Speed

No: None

Product Description

The metal sintered ultra thin and precision Diamond Blade is with the speciality of strong-hold grains and exellent wearability. It fits to be used for the cutting and grooving of electronic and optical materials, also could be used for the cutting and grooving of ceramic and Semiconductor Materials with its good rigidity

Features:

1.Extensive bond lineup can meet the variety of applications
2.Realized higher cutting speed and better cutting quality than the resin blade
3.With high rigidity, it can handle the thin blade with great straightness, it can also perform the high-speed cutting
4.Metal blade series specialized in the glass cutting

Cutting conditons

Spindle speed 25-30K RPM
Feed Speed 120mm/sec
BGA 0.5㎜

SpecificationS

Shape

Shape
1A8
Specification

Grit type Grite size Concentration Bond
SD 320 75 MS07

Grit Type

SD Standard grit
SDC Coating grit

Mesh Size

Mesh size SD SDC
2000 ok

1500 ok

1200 ok
ok
1000 ok
ok
900 ok
ok
800 ok
ok
700 ok
ok
600 ok
ok
500 ok
ok
400 ok
ok
320 ok
ok

Dimension

O.D.
Blade thickness
I.D.
60 0.25 40

D.D.(mm) Blade thickness(mm)
I.D
Availability size Tolerance Availabiility size Tolerance Availabiility size
Tolerance
500-100 +0.05/-0 0.05-0.5 ±0.005 25.4-88.9 H6

Contact us if you need more details on Diamond Dicing Blade for BGA. We are ready to answer your questions on packaging, logistics, certification or any other aspects about BGA Cutting Blade、BGA Cutting Diamond Blade. If these products fail to match your need, please contact us and we would like to provide relevant information.

Product Categories : The Blade Series > Metal-Bond Dicing Blade

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