We have a professional production line for wafer cutting,They are mainly used for grooving and cutting with high accuracy and slight cutting depth,High sintering technologies bring out the properties to correspond to the various applications.A unique manufacturing processes offer the even distribution of the grit and performance stability.Improved the high cutting ability and wear resistance using the special grit.
1. Semiconductor, such as BGA, LGA, LED, diode, etc.
2. Optical Glass, such as filter, blue glass, crystal, gem, etc.
3. Optical communication, such as V-shape slotting on quartz and cutting quartz cover;
4. Other materials, such as magnetic materials, carbide, tool steel, stainless steel, etc
|Spindle speed||25-30K RPM|
|Depth into UV tape||40um|
|Grit type||Grite size||Concentration||Bond|
SD Standard grit SDC Coating grit
Mesh size SD SDC 4000 ok
| O.D. || Blade thickness || I.D. |