Company Details

  • Suzhou Sail Science & Technology Co., Ltd.

  •  [Jiangsu,China]
  • Business Type:Manufacturer
  • Main Mark: Americas , Asia , Europe , North Europe , Worldwide
  • Exporter:51% - 60%
  • Certs:ISO9001
  • Description:Dicing Blade for Cutting QFNs,Dicing Blade for Cutting LED,Dicing Blade for WLCSP
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Suzhou Sail Science & Technology Co., Ltd.

Dicing Blade for Cutting QFNs,Dicing Blade for Cutting LED,Dicing Blade for WLCSP

Home > Products > The Blade Series > Metal-Bond Dicing Blade > Wafer cutting Metal bond dicing blades

Wafer cutting Metal bond dicing blades

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    Payment Type: T/T
    Incoterm: FOB,CIF,CIP
    Delivery Time: 10 Days

Basic Info

Type: Die Grinder

Power Source: Electricity

Object: Saw Blade

Application: Construction

Disc(Wheel) Type: Cutting Disc

Material: Metal

Working Style: High-speed universal

Variable Speed: With Variable Speed

No: None

Product Description

We have a professional production line for wafer cutting,They are mainly used for grooving and cutting with high accuracy and slight cutting depth,High sintering technologies bring out the properties to correspond to the various applications.A unique manufacturing processes offer the even distribution of the grit and performance stability.Improved the high cutting ability and wear resistance using the special grit.
Suit for:
1. Semiconductor, such as BGA, LGA, LED, diode, etc.
2. Optical Glass, such as filter, blue glass, crystal, gem, etc.
3. Optical communication, such as V-shape slotting on quartz and cutting quartz cover;
4. Other materials, such as magnetic materials, carbide, tool steel, stainless steel, etc
Cutting conditons

Spindle speed 25-30K RPM
Feed Speed 5-8mm/sec
Depth into UV tape 40um


SpecificationS

Shape

Shape
1A8
Specification

Grit type Grite size Concentration Bond
SD 800 25 MS09T1H

Grit Type

SD Standard grit
SDC Coating grit

Mesh Size

Mesh size SD SDC
4000 ok
2500 ok

2000 ok

1500 ok

1200 ok
ok
1000 ok
ok
900 ok
ok
800 ok
ok
700 ok
ok
600 ok
ok
500 ok
ok
400 ok
ok
320 ok
ok

Dimension

O.D.
Blade thickness
I.D.
58 0.15 40


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Product Categories : The Blade Series > Metal-Bond Dicing Blade

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  • Wafer cutting Metal bond dicing blades
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