Sail Vitrified-bond Griding Wheels are mainly used for the thinning and fine grinding of the silicon wafer. These products were produced by our company, which possess superior grinding performance and high cost performance, are among the top level worldwide. They are usually used for back thinning, grinding and fine grinding of monocrystalline silicon and some other Semiconductor Materials.
Good self-sharpening performance and good elasticity
High grinding efficiency and low grinding temperature
High processing precision and good surface quality
Silicon wafers Sapphire GaN GaAs
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