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Sail Vitrified-bond Griding Wheels

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Metal Edge Grinding Wheel
Brand:SAIL-TECH
Packaging:Bags or Cartons
Certificate:ISO9001:2008
Model No.:SD320V07
Metal Edge Grinding Wheel Metal Edge Grinding Wheel are porous,which mainly used for back thinning of wafer.This Kind of grinding wheels also have a long life and high-speeding . Feature: l Porous l High-speed(Vmax=500μm/min) l Long life and good quality l Offer variety of special requirements. Material of workpieces:...
Vitrified Diamond Grinding Wheels
Brand:SAIL-TECH
Packaging:Bags or Cartons
Certificate:ISO9001:2015
Model No.:SD320
Silicon grinding wheels are mainly used for the thinning and fine grinding of the silicon wafer. These products produced by our company,which possess superior grinding performance and high cost performance,are among the top level worldwide. They are usually used for back thinning, grinding and fine grindingof...
Vitrified Bond Drinding Discs
Brand:SAIL-TECH
Packaging:Bags or Cartons
Certificate:ISO9001:2008
Model No.:SD320V70
Silicon grinding wheels are mainly used for the thinning and fine grinding of the silicon wafer. These products produced by our company,which possess superior grinding performance and high cost performance,are among the top level worldwide. They are usually used for back thinning, grinding and fine grindingof...
Vitrified-bond Griding Wheels for Silicon Wafter
Brand:SAIL-TECH
Packaging:Bags or Cartons
Certificate:ISO9001:2015
Model No.:SD280
Silicon grinding wheels are mainly used for the thinning and fine grinding of the silicon wafer. These products produced by our company,which possess superior grinding performance and high cost performance,are among the top level worldwide. They are usually used for back thinning, grinding and fine grindingof...
China Sail Vitrified-bond Griding Wheels Suppliers

Sail Vitrified-bond Griding Wheels are mainly used for the thinning and fine grinding of the silicon wafer. These products were produced by our company, which possess superior grinding performance and high cost performance, are among the top level worldwide. They are usually used for back thinning, grinding and fine grinding of monocrystalline silicon and some other Semiconductor Materials.

Characters

Good self-sharpening performance and good elasticity

High grinding efficiency and low grinding temperature

High processing precision and good surface quality

Silicon wafers Sapphire GaN GaAs