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Vitrified-bond Griding Wheels for Silicon Wafter

Basic Info

Model No.: SD280

Material: Diamond

Abrasive: Superabrasive

Shapes: Section Shape

Types: Surface Grinding Wheel

Cylindricity: <0.02

Circular Degree: <0.01

Technics: Sinter

Working Style: Surface Grinding

Product Name: Vitrified-bond Griding Wheels

Grid: 280

Bond: V70

Outer Diameter: 195D

Thickness: 170mm

Product Description

Silicon Grinding Wheels are mainly used for the thinning and fine grinding of the silicon wafer. These products

produced by our company,which possess superior grinding performance and high cost performance,are

among the top level worldwide. They are usually used for back thinning, grinding and fine grindingof monocrystalline silicon and some other Semiconductor Materials.

The ordering suggestion:

When first order, please provide the following parameters for the purpose of selecting the most suitable

wheels for you.

1. Drawings or detailed specification of the grinding wheels and wafer size.

2. Grinder model or grinding mode of the grinder.

3. Grinding allowance, in-feed rate, rotate speed of each spindle.

4. Precision requirements of work piece.




Contact us if you need more details on Grinding Wheels for Silicon Wafter. We are ready to answer your questions on packaging, logistics, certification or any other aspects about Vitrified-bond Wheels、Vitrified-bond Wheels for Silicon Wafter. If these products fail to match your need, please contact us and we would like to provide relevant information.

Product Categories : Sail Grinding Wheel Series > Sail Vitrified-bond Griding Wheels

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