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Sail Ultre-thin Metal-bond Blade

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Metal bond saw blade
Brand:SAIL-TECH
Packaging:Bags or Cartons
Certificate:ISO9001:2008
Model No.:M1E8
Metal bond saw blade Metal bond saw blade is used for deep cutting and grooving. Good wear resistance, good shape maintenance and long worklife. 1A1/3、1A1R/4 type without water slot 1A1/5、1A1R/6 type with water slot. Cutting wheels of 1A1 type: The thickness of work layer is as same as steel plate. They are mainly...
Ultra-thin Metal-bond Dicing Blade
Brand:SAIL-TECH
Packaging:Bags or Cartons
Certificate:ISO9001:2015
Model No.:SM1E8
The metal sintered ultra-thin dicing blade is with the speciality of strong-hold grains and excellend wear-resistance.It fits to be used for the cutting and grooving of electronic and optical materials. Product characteristics - Excellent wearing resistance,suitable for the machining of difficult-to-cut materials. -...
Metal Superthin Cutting Blades
Brand:SAIL-TECH
Packaging:Bags or Cartons
Certificate:ISO9001:2008
Model No.:IA8
Dicing blade 58mm 100mm 150mm 152mm 175mm 200mm 250mm Diamond grinding wheels for cutting wafer/ Magnetic materials /carbide / optical glass / Gemstone Product Overviews 1.The introduction of Super Thin Diamond /CBN Grinding wheel / Dicing blade/ Grinding disc / Diamond CBN cutting wheel Application: Mainly used for...
Thinning or Back Grinding Wheel
Brand:SAIL-TECH
Packaging:Bags or Cartons
Certificate:ISO9001:2008
This type of wheel is mainly used for fine grinding in photovoltaic semiconductor industry. With high efficiency and cost effective, it performs well on Japan and Germany grinding machines,which mainly used for back thinning of sapphire epitaxial wafer, silicon wafer,gallium aresenide and GaN wafer. Feathers: 1.Good...
Metal Blade for Glass Dicing Soln
Brand:SAIL-TECH
Packaging:Bags or Cartons
Certificate:ISO9001:2008
Model No.:MIE8SD600
Product Description High precision diamond & CBN saw blade are used for cutting carbide,optics, sapphire, ceramics and semiconductor material Metal bond blade Good wear resistance, good shape maintenance and long worklife. Resin bond blade Goodself-sharpen, perfect fracture surface quality. Saw blade without...
Metal Bonded Dicing Blades
Brand:SAIL-TECH
Packaging:Bags or Cartons
Certificate:ISO9001:2008
The metal sintered ultra thin and precision diamond blade is with the speciality of strong hold grains and exellent wearability. It fits to be used for the cutting and grooving of Electronic and optical materials, also could be used for the cutting and grooving of ceramic And semiconductor materials with its good...
1A8 Metal Bond Cutting Blades
Brand:SAIL-TECH
Packaging:Bags or Cartons
Certificate:ISO9001:2015
It is available for the application that is wide from brittle materials such as glass or the Ceramics to semiconductor packages such as CSP or QFN by an abundant bond lineup,especially for WLCSP cutting. In addition, the sharpness and balance of the life provide the product which they got by intensive degree control a...
52MM Diamond cutting wheel for quartz
Brand:SAIL-TECH
Packaging:Bags or Cartons
Certificate:ISO9001:2015
Diamond cutting wheels for carbide bar/Diamond grinding wheels for carbide bar Application: Mainly used for grooving and cutting various crisp and hard materials. Such as semiconductor and packaging material, tungsten carbide bar, glass tube, ceramic tube, magnetic material, crystal, glass, quartz, printing circuit...
Ultra-thin Metal-bond Dicing Blade for Ceramics
Brand:SAIL-TECH
Packaging:Bags or Cartons
Certificate:ISO9001:2015
Model No.:SM1M8
Suzhou Sail technology has always been concerned about the development of new products, new technology breakthrough, so as to continuously improve the core competitiveness of products. Suzhou Sai'er technology through the ISO9001:2008 quality system certification, and was awarded as "high tech enterprise" and "small...
Metal Bond Diamond Dicing Blade.
Brand:SAIL-TECH
Packaging:Bags or Cartons
Certificate:ISO9001:2015
Model No.:SM1E8
It is available for the application that is wide from brittle materials such as glass or the Ceramics to semiconductor packages such as CSP or QFN by an abundant bond lineup,especially for WLCSP cutting. In addition, the sharpness and balance of the life provide the product which they got by intensive degree control a...
Diamond Dicing Blade For Electronic Industry
Brand:SAIL-TECH
Packaging:Bags or Cartons
Certificate:ISO9001:2015
Model No.:SM1E8
The metal sintered ultra-thin dicing blade is with the speciality of strong-hold grains and excellend wear-resistance.It fits to be used for the cutting and grooving of electronic and optical materials. Product characteristics - Excellent wearing resistance,suitable for the machining of difficult-to-cut materials. -...
Diamond blade for optical glass
Brand:SAIL-TECH
Packaging:Bags or Cartons
Certificate:ISO9001:2015
Model No.:M1A8
The metal sintered ultra thin and precision diamond blade is with the speciality of strong-hold grains and exellent wearability. The metal-bond dicing blade fits to be used for the cutting and grooving of electronic and optical materials, also could be used for the cutting and grooving of ceramic and semiconductor...
metal dicing blades for ceramics
Brand:SAIL-TECH
Packaging:Bags or Cartons
Certificate:ISO9001:2008
Model No.:MIE8SD1500
Product Description High precision diamond & CBN saw blade are used for cutting carbide,optics, sapphire, ceramics and semiconductor material Metal bond blade Good wear resistance, good shape maintenance and long worklife. Resin bond blade Goodself-sharpen, perfect fracture surface quality. Saw blade without...
ultra-thin precision sintered metal scribing wheel
Brand:SAIL-TECH
Packaging:Bags or Cartons
Certificate:ISO9001:2008
Model No.:MIA8SD1000N
Product Description High precision diamond & CBN saw blade are used for cutting carbide,optics, sapphire, ceramics and semiconductor material Metal bond blade Good wear resistance, good shape maintenance and long worklife. Resin bond blade Goodself-sharpen, perfect fracture surface quality. Saw blade without...
Metal Bond Diamond Dicing Blade
Brand:SAIL-TECH
Packaging:Bags or Cartons
Certificate:ISO9001:2008
Model No.:MIA8SD1500N
High precision cutting blade are manufactured by unique technology with sintered metal powder with diamond abrasives. they are mainly used for grooving ceramic(Al2O3),oxide film and metallic films provides high precision,narrow grooving and long life. direction of use: 1. insulation board and insulation rings should...
Ultra-thin Presision Metal-bond Dicing Blade
Brand:SAIL-TECH
Packaging:Bags or Cartons
Certificate:ISO9001:2008
Model No.:MIE8SD1000
High precision cutting blade are manufactured by unique technology with sintered metal powder with diamond abrasives. they are mainly used for grooving ceramic(Al2O3),oxide film and metallic films provides high precision,narrow grooving and long life. direction of use: 1. insulation board and insulation rings should...
Metal Sintered Blades
Brand:SAIL-TECH
Packaging:Bags or Cartons
Certificate:ISO9001:2008
Model No.:MIE8
Diamond electrodeposited slotting wheel/blade High precision cutting bladeare manufactured by unique technology with sintered metal powder with diamond abrasives. they are mainly used for grooving ceramic(Al2O3),oxide film and metallic films provides high precision,narrow grooving and long life. direction of use: 1....
Metal Dicing Blades for BGA
Brand:SAIL-TECH
Packaging:Bags or Cartons
Certificate:ISO9001:2008
Model No.:MIA8
Metal Sintered Blades Highly versatile blades for a variety of softand hard material applicatuions A Comprehensive Dicing Solution 1.The widest variety of matrices for a board range of applications 2Less wear/higher blade life 3.Highly accurate blade dimensions 4.High precision dicing 5.Attractive cost-of-ownership A...
Metal-bond Dicing Blade for BGA
Brand:SAIL-TECH
Packaging:Bags or Cartons
Certificate:ISO9001:2008
Model No.:M1A8
thin diamond saw blade 1. High cutting efficiency with better smoothness 2. Competitive price Processing objects QFN.optical glass.ceramic materials ect. Features: 1.Long life and stable performance 2.Good cutting result and high efficiency 3.Produce all kinds of specifications 4.Any package upon request 5.Delivery on...
ultra-thin metal bond blades
Brand:SAIL-TECH
Packaging:Bags or Cartons
Certificate:ISO9001:2008
Model No.:M1V8
Sail company provide excellent cutting performance based on unique powder metallurgy technology for long years and the blades is applied to provide any solutions to customers now . High precision cutting blade are manufactured by unique technology with sintered metal powder with diamond abrasives. they are mainly used...
Glass Dicing Soln Metal Blade
Brand:SAIL-TECH
Packaging:Bags or Cartons
Certificate:ISO9001:2008
Model No.:M1E8
Diamond electrodeposited slotting wheel/blade High precision cutting bladeare manufactured by unique technology with sintered metal powder with diamond abrasives. they are mainly used for grooving ceramic(Al2O3),oxide film and metallic films provides high precision,narrow grooving and long life. direction of use: 1....
Diamond electrodeposited slotting wheel/blade
Brand:SAIL-TECH
Packaging:Bags or Cartons
Certificate:ISO9001:2008
Model No.:M1M8
Diamond electrodeposited slotting wheel/blade High precision cutting bladeare manufactured by unique technology with sintered metal powder with diamond abrasives. they are mainly used for grooving ceramic(Al2O3),oxide film and metallic films provides high precision,narrow grooving and long life. direction of use: 1....
1E8 Metal Bond Cutting Blades
Brand:SAIL-TECH
Packaging:Bags or Cartons
Certificate:ISO9001:2008
Model No.:M1E8
Grinding wheels(Metal-bond Wheels) The Metal-bond wheels are mainly used for back thinning of sapphire epitaxial wafer,silicon wafer,gallium arsenide and GaN wafer.This Kind of grinding wheel developed in our company can replace imported products. Material of workpieces: Sapphire epitaxial wafer,silicon wafer,gallium...
Sapphaire thinning grinding wheels
Brand:SAIL-TECH
Packaging:Bags or Cartons
Certificate:ISO9001:2008
Model No.:SD06
This type of wheel is mainly used for fine grinding in photovoltaic semiconductor industry. With high efficiency and cost effective, it performs well on Japan and Germany grinding machines,which mainly used for back thinning of sapphire epitaxial wafer, silicon wafer,gallium aresenide and GaN wafer. Feathers: 1.Good...
China Sail Ultre-thin Metal-bond Blade Suppliers

Ultra-Thin Metal-Bond Dicing Blade

The metal sintered ultra-thin dicing blade is with the speciality of strong-hold grains and excellend wear-resistance.It fits to be used for the cutting and grooving of electronic and optical materials.

Product characteristics

- Excellent wearing resistance,suitable for the machining of difficult-to-cut materials.

- With high rigidity,Effectively escape from wavy and slant cutting

- Wide range of bonds for different appliactions such as the cutting of glass,ceramics and CSP,etc.

Processing Materials

Ceramics.Sapphire.Optical Glass.quartzs.BGA.CSP