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Resin Bond Blade

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Nickel Bond Electroform Diamond Wafer Dicing Blades
Model No.:
 EDWDB

Diamond Tire Section Cutting Wire Saw

We are proud to be a leading manufacturer of Super Abrasives, delivering cutting-edge technology and top-quality products and services to a wide range of industries. Our high-performance diamond tools are...
used grinding wood blue zricon flap disc
Brand:
 Yuteng
Packaging:
 Cartons
Supply Ability:
 20000pcs/day
Min. Order:
 5000
Model No.:
 YT-FL-B
Place of Origin:
 Kaifeng, China

Zirconia Flap Disc

HENAN YUTENG ABRASIVES CO., LTD.---Located in Kaifeng City, which is one of the coated abrasives production based in China. We specialized in producing and selling the "Velcro Abrasives Discs""Hook & Loop...
Resin Bond Concrete Polishing Pads Floor
Min. Order:
 1
Transportation:
 Ocean

Concrete Grinder

Ningbo Max machinery Co.,Ltd, is an export-oriented manufacture company, It was built at a former manufacturing enterprise which is based on the light construction machinery,specialized in producing concrete...
Resin bond daimond dicing Blade for wafer semicoductor
Brand:SAIL-TECH
Packaging:bags and carton
Certificate:ISO9001:2008
Resin bond blade has rich elasticity and good self-sharpening,resin bond blade is widely used in sigulation field of semiconductor packing meterials and optical materials.A series of bonds in our company can meet different cutting requirements.What's more,we can provide customers service for different specifications...
Resin Bond Diamond Saw Blade for Metal Steel
Brand:SAIL-TECH
Packaging: Carton package for small size wheel Carton+plastic foam for big size wheel
Certificate:ISO9001:2008
Resin bond saw blade for cutting kinds of hard material is two kinds of saw blades. Metal bond saw blades are high precision for the abrasive grain and durable, with high speed, small joint-cutting and fine machined surface. Resin Bond Saw Blade are low precision for the abrasive grain and poor heat resistance, but...
Metal and resin bond diamond flat wheel
Brand:SAIL-TECH
Packaging: Carton package for small size wheel Carton+plastic foam for big size wheel
Certificate:ISO9001:2008
1. Name: Metal and resin bond diamond flat wheel 2. Feature: Sharp, wear-resisting, polishing effect is good, stable quality, gooddiamond, Positioning hole, Cooling hole 3. Machine: Straight edge machine, beveling machine, bilateral machine, numerical control machine, Italy 4. Market: Germany, Italy, India, Egypt,...
Sintered Diamond Diamond Saw blade
Brand:SAIL-TECH
Packaging: Carton package for small size wheel Carton+plastic foam for big size wheel
Certificate:ISO9001:2008
Product Description Ceramic Saw Blade, 125mm sintered Continuous Saw Blade Why choose us: Sailcompany , Established in 2010year, Rich producing experience. Well approved by our worldwide clients, export more than 70 countries. Success formula for concrete saw blade Quick Delivery time. One-Day reply to your inquiry...
Resin Bond Dicing Blade
Packaging:bags and carton
Model No.:B1A8SDC170N100BF401
Resin bond blade has rich elasticity and good self-sharpening,resin bond blade is widely used in sigulation field of semiconductor packing meterials and optical materials.A series of bonds in our company can meet different cutting requirements.What's more,we can provide customers service for different specifications...
Hubbed resin bond diamond blade
Brand:SAIL-TECH
Packaging:bags and carton
Certificate:ISO9001:2008
Resin bond blade has rich elasticity and good self-sharpening,resin bond blade is widely used in sigulation field of semiconductor packing meterials and optical materials.A series of bonds in our company can meet different cutting requirements.What's more,we can provide customers service for different specifications...
IA8 Cutting Blades For QFN
Brand:SAIL-TECH
Packaging:bags and carton
Certificate:ISO9001:2008
Resin bond blade has rich elasticity and good self-sharpening,resin bond blade is widely used in sigulation field of semiconductor packing meterials and optical materials.A series of bonds in our company can meet different cutting requirements.What's more,we can provide customers service for different specifications...
1A8 Resin Bond Diamond Cutting Blade For Semiconductor
Packaging:bags and carton
Model No.:B1V8SDC280L125
Resin bond blade has rich elasticity and good self-sharpening,resin bond blade is widely used in sigulation field of semiconductor packing meterials and optical materials.A series of bonds in our company can meet different cutting requirements.What's more,we can provide customers service for different specifications...
Resin bond blade for glass
The new series blade realizes high-grade processing of hard, brittle materials, such as optical glass materials. It also has a wide range of bonds to support various needs. These new blades have Sharp cutting edges, achieve small chipping for both the front and backside, and have longer blade life. These blades employ...
High wear resistance resin blade
The BF813 series blades have good wear resistance and high accuracy, the longest service life for QFN singulation is 6600m. Features: 1. High accuracy 2. Long life span 3. Strong hold of grits 4. Slight cutting depth 5. Good wear resistance 6. Good shape keeping ability Cutting conditons Specifications Shape...
cutting blades for  Packaging Materials
Sintered resin powder is used as the bonding agent material to realize strong holding power. As a result, these blades have low blade wear. These blades are ideal for high precision grooving and cutting of electronics parts or optical devices. Main features: Minimized blade wear and high cutting ability High rigidity...
Stable working resin bond lade for DFN
Resin bond blade for cutting DFN has very good shape retention, small blade deformation during cutting process. These features insure blade dicining stability. Features: 1.Narrow cutting kerfs, for saving valuable material 2.Sharp-edged, high efficiency 3.Good rigidity, high strength and long life span Instructions:...
Stable dicing for DFN
This series blade is designed for cutting DFN material. By increasing the bond sharpness, the blade realize stable and high quality processing. Features: 1.Providing cutting solution according to customer material. 2. Reducing the chipping problem. 3.Improving the cutting quality. 4.This blade has very good wear...
Excellent procssing quality blade
The BF912 sereis resin bond blade is used in QFN singulation area. This type of blade has not only good processing quality, but good wear resistance. These advangtages make the baldes a good choice for cost reduction. Features: 1. High accuracy 2. Long life span 3. Strong hold of grits 4. Slight cutting depth 5. Good...
Superabrasive cutting wheels for DFN
The high precision superabrasive cutting wheels are mainly used for precise cutting kinds of electronic component and precise part in electronic information and the mechanical fields.The resin bond cutting wheels can self-sharpen and cut sharply. The quality of surface can be improved due to the elastic resin bond....
High dicing efficiency resin bond blade
Model No.:BR10
This kind of bind added many lubrication materials, make the blade has good self-sharpening, suitable for cutting hard brittle material such as glass, ceramics. Main features: 1.Goodself-sharpen, perfect fracture surface quality. 2.Narrow cutting kerfs, for saving valuable materia. 3.Sharp-edged, high efficiency. 4....
Resin bond diamond blade for QFN materials
These sintered diamond blades employ heat-hardened resin as the bonding agent which provides active self-sharpening and elasticity characteristics.They are suitable for processing of hard-to-cut materials such as glass and crystal materials. Features: 1.Suitable for highly fragile materials such as glass 2.A wide...
Good precision type cutting blades
Sintered resin powder is used as the bonding agent material to realize strong holding power. As a result, these blades have low blade wear. These blades are ideal for high precision grooving and cutting of electronics parts or optical devices. Main features: Minimized blade wear and high cutting ability High rigidity...
Sharp Resin Bond Blade
The serise of Blade adopt ginding process after hot-compaction, this process can improve the accuracy and reduce the deformation, meanwhile used diamond expose sufficiently. The blade have the high-quality and the long life in cutting QFN material. Features: 1.A Wide Range of Grit Sizes 2.Variable Bond Hardness...
Ultra-thin resin bond blade
This bond material was developed for the BR10 resin bond blade series to match the characteristics of the glass material that will be processed. With the newly develop bond range, it is possible to satisfy both high-grade and high-speed processing. Main features: 1.High processing quality for cutting thin glass...
High quality singulation for QFN
BR686 is the most matured product, has been widely used for dicing QFN and related materials from 2012. Product Features: 1. High accuracy 2. Long life span 3. Strong hold of grits 4. Slight cutting depth 5. Good wear resistance 6. Good shape keeping ability Cutting conditons Specifications Shape Specification Grit...
High precision and superthin superabrasive cutting blade
The high precision superabrasive cutting wheels are mainly used for precise cutting packaging materials in the electronic information and the mechanical fields. Main features 1.High precision, for cutting QFN with less procedure 2.Narrow cutting kerfs, for saving valuable material 3.Sharp-edged, high efficiency 4.Good...
Precision and superthin superabrasive cutting blade
The high precision superabrasive cutting wheels are mainly used for precise cutting packaging materials in the electronic information and the mechanical fields. Main features 1.High precision, for cutting QFN with less procedure 2.Narrow cutting kerfs, for saving valuable material 3.Sharp-edged, high efficiency 4.Good...
High dicing efficiencydiamond  resin bond blade
Model No.:BR10
This kind of resin bond have some lubrication materials, so these blades has good self-sharpening ability,They are designed for cutting hard brittle material such as glass, ceramics. Main features: 1.Goodself-sharpen, perfect fracture surface quality. 2.Narrow cutting kerfs, for saving valuable materia....
China Resin Bond Blade Suppliers
Resin Bond Blade

Resin bond blade has Rich elasticity and good self-sharpening, it is widely used in singulation field of semiconductor packaging materials and optical materials. A series of bonds in our company can meet different cutting requirements. What`s more, we can provide customers service for different specifications and types according their needs.

Processing objects

QFN, DFN, Optical Glass, ceramic materials.

*Related Products:Blade For Brittle Materials,Dicing For Qfn.