Resin Bond Blade
Resin bond blade has Rich elasticity and good self-sharpening, it is widely used in singulation field of semiconductor packaging materials and optical materials. A series of bonds in our company can meet different cutting requirements. What`s more, we can provide customers service for different specifications and types according their needs.
QFN, DFN, Optical Glass, ceramic materials.
*Related Products:Blade For Brittle Materials,Dicing For Qfn.