Sharp Resin Bond Blade

The serise of Blade adopt ginding process after hot-compaction, this process can improve the accuracy and reduce the deformation, meanwhile used diamond expose sufficiently. The blade have the high-quality and the long life in cutting QFN material.

Features:

1.A Wide Range of Grit Sizes

2.Variable Bond Hardness

3.Choose From many Diamond Concentrations

4.Solution for long life cutting

5.Ready for narrow saw kerf wafer dicing

Cutting conditons

Spindle speed	23-25K RPM
Feed Speed	60mm/sec
Depth into UV tape	50μm

SpecificationS

Shape

Shape

1A8

Specification

Grit type	Grite size	Concentration	Bond
SDC	220	65	BF912

Dimension

O.D.	Blade thickness	I.D.
58	0.33	40

Contact us if you need more details on The Diamond Blade. We are ready to answer your questions on packaging, logistics, certification or any other aspects about The Superhard Blade、Diamond Dicing Blade. If these products fail to match your need, please contact us and we would like to provide relevant information.

Product Categories : The Blade Series > Resin Bond Blade