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The Hubless Nickel Dicing Blade

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Eletroformed Dicing Blades with Hub
Brand:SAIL-TECH
Packaging:Bags or Cartons
Certificate:ISO9001:2008
2" Hubbed Nickel Bonded Blades Used to cut Silicon and III-V . This type of ultra-thin blade is created using a special electrodepositing technique to hold the cutting diamonds in a nickel alloy matrix. This results in a blade that can be made very thin with good wear rate and good cut quality. • Stronger Blade •...
Hubbed Nickel Blades
Brand:SAIL-TECH
Packaging:Bags or Cartons
Certificate:ISO9001:2008
2" Hubbed Nickel Bonded Blades Used to cut Silicon and III-V . This type of ultra-thin blade is created using a special electrodepositing technique to hold the cutting diamonds in a nickel alloy matrix. This results in a blade that can be made very thin with good wear rate and good cut quality. • Stronger Blade •...
The Multifunction Hubless Nickel Dicing blade
These blades employ electroformed bonds that realize superb cutting quality and blade life.In addition to dicing semiconductor wafers, these blades are suitable for dicing a wide variety of semiconductor packages. Features: 1. Deep cutting and grooving are possible using ultra-thin blades. 2. Blade thickness 0.015 mm...
Electroformed Hubless Diamond Blade
Brand:SAIL-TECH
Packaging:Bags or Cartons
Certificate:ISO9001:2008
Model No.:BTNBC06
Suzhou Sail technology co., LTD uses the advanced electroplating process and unique diamond dispersion technology, can make the hub blade of different specifications . hardness and concentration, the different craft and formula are used for different customers. We can effectively improve the quality and life of the...
Hubless Blade
Packaging:BAGS OR CARTOONS
Model No.:BTNBC
Suzhou Sail technology company uses the advanced electroplating process and unique diamond dispersion technology,can make the hub blade of different specification,hardness and concentration ,the different craft and formula are used for different cusstomers. Electroformed hubless diamond blade is a kind of ultra and...
The Hubless Nickel Dicing Blade for Ceramic
Packaging:BAGS OR CARTOONS
Model No.:BTNBC
BCDS series hubless nickel Dicing blade realize the high cuttting of ceramics materials by reducing the diamond concentration and the bond strength. We are delicated to customer needs to offer two kinds of blades in the high life and the high quality. Electroformed hubless diamond blade is a kind of ultra and...
The Hubless Nickel Dicing Blade for Packaging Materials
The Hubless Blade is a breakthrough from traditional package singulation solution,enabling step function improvement on cut quality, precision & productivity with significantly longer blade life, enabling ZERO Conversion of your singulation process. Features: 1. Up to 6X longer blade life 2.Hubless configuration...
The Hubless Nickel Dicing Blade for LED
Hubless Blades enables step function improvement on package singulation quality, precision and productivity by providing significantly longer life blade, improved stability. It is designed to fit and achieve your process and project requirement. Features: 1. Cutting-edge electro-plating technology for achieving high...
The High Precision and Superthin Hubless Blade
The high precision superabrasive cutting wheels are mainly used for precise cutting and slotting kinds of electronic component and precise part in the electronic information and the mechanical fields. features: 1.High precision, for grooving and cutting with less procedure 2.Narrow cutting kerfs, for saving valuable...
The High Life Hubless Nickel Dicing Blade
The series developed for dicing various substrates adopts a larger grit size compared to the hub blades for semiconductor wafers. Also, the abundant concentration lineup responds to various customer requests. 1. Increases the choices for a blade thanks to the technology realizing more detailed classification of...
The Hubless Nickel Dicing Blade for Substrates
The series developed for dicing various substrates adopts a larger grit size compared to the hub blades for semiconductor wafers. Also, the abundant concentration lineup responds to various customer requests. Features: 1. High processing quality for cutting of hard, brittle materials 2.High-speed processing of hard,...
The Ultra-Thin Hubless Nickel Dicing Blade
BLFH series hubless nickel Dicing blade realize the ultra-thin cutting. The ultra-thin blade is produced by alkali corrosion of aluminum alloy to reduce the deformation. With high strength bond, the blade improve processing stability and reduce wavy cutting. Electroformed hubless diamond blade is a kind of ultra and...
The Hubless Nickel Dicing Blade for PCB
THis series blade is designed for the Printed Circuit Board material. Provide different diamond concentration for client to chooes, In processing hard and brittle materials, process quality is improved while blade life is maintained. Features: 1. 5 diamond concentration levels support diverse applications. 2. The...
The Hubless Nickel Dicing Blade by Porous Structue
The series combines high cutting ability that is specific to electroformed bond blades and appropriate self sharpening ability by forming pores in the electroformed bond. It is now possible to process silicon + glass, silicon carbide (SiC) and other materials that have been difficult to cut with conventional...
China The Hubless Nickel Dicing Blade Suppliers

Ultra-thin Saw Blade: The Hubless Nickel Dicing Blade have the Ultra high precision and the Ultra-thin thickness, the blade thin to 40μm, meanwhile according to the different needs of customers, we can manufacture different precison blade.

The Printed Circuit Board Dicing Blades: The Printed Circuit Board material cutting use the Hubless Nickel Dicing Blade at 80~90 percent. Besides the high life and the high cutting quality, the blade have the high shape preserving.

The Ceramic Dicing Blades Dicing Blades: The Hub Nickel Dicing Blade can be widely used in Ceramic Dicing, the blade have extremely high life than oher bond blade, meanwhile the cutting quality can satisfy customer requirement. Such as Dicing Blade For Cutting Bga.