Shapes: Edge Shape
Types: Cutting Wheel
Circular Degree: <0.01
Working Style: Cutting
The series developed for dicing various substrates adopts a larger grit size compared to the hub blades for semiconductor wafers. Also, the abundant concentration lineup responds to various customer requests.
1. Increases the choices for a blade thanks to the technology realizing more detailed classification of concentration
2. Reduces interval dressing by selecting a low-concentration blade
3. Realizes highly straight processing and increases the process speed thanks to the high strength bond
The blade Specifications:
|The blade bond||Abrasive||Thehnics||The blade thickness|
|The blade precisiong||Cutting material||Abrasive size||O.D.|
|10μm||Silicon Ceramics PZT||600~3000#||56.00~60.00mm|
|64|| || |
he cutting parameters:
|Spindle rate||Feed speed||cut depth|
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