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The High Life Hubless Nickel Dicing Blade

Product Description

The series developed for dicing various substrates adopts a larger grit size compared to the hub blades for semiconductor wafers. Also, the abundant concentration lineup responds to various customer requests.

1. Increases the choices for a blade thanks to the technology realizing more detailed classification of concentration

2. Reduces interval dressing by selecting a low-concentration blade

3. Realizes highly straight processing and increases the process speed thanks to the high strength bond

The blade Specifications:

The blade bond Abrasive Thehnics The blade thickness
Nickel Diamond Eletroplating 100~300μm
The blade precisiong Cutting material Abrasive size O.D.
10μm Silicon Ceramics PZT 600~3000# 56.00~60.00mm

Slotting specification:

Number Width(mm) Depth(mm)
8 0.5 1
16 1 2
32 1.2 3

he cutting parameters:

Spindle rate Feed speed cut depth
30~50K/min 10~80mm/s 0.5~1.0mm

Contact us if you need more details on The High Binding Force Blade. We are ready to answer your questions on packaging, logistics, certification or any other aspects about Different Specifications in Diamond Concentration、Both Life and Quality. If these products fail to match your need, please contact us and we would like to provide relevant information.

Product Categories : The Blade Series > The Hubless Nickel Dicing Blade

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