The Hubless Nickel Dicing Blade by Porous Structue
The series combines high cutting ability that is specific to electroformed bond blades and appropriate self sharpening ability by forming pores in the electroformed bond. It is now possible to process silicon + glass, silicon carbide (SiC) and other materials that have been difficult to cut with conventional electroformed bonds.
1. Reallizes one-pass processing of glass + Silicon wafer.
2. Realizes high-quality processing of silicon carbide (SiC) and other difficult-to-cut materials.
3. Two types available: standard and low concentration.
The blade Specifications:
|The blade bond||Abrasive||Thehnics||The blade thickness|
|The blade precisiong||Cutting material||Abrasive size||O.D.|
|10μm||Silicon and glass||600~2000#||54.00~56.00mm|
|64|| || |
he cutting parameters:
|Spindle rate||Feed speed||cut depth|
|30~50K/min||10~80mm/s|| 0.5~1.0mm |