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The Hubless Nickel Dicing Blade by Porous Structue

Product Description

The series combines high cutting ability that is specific to electroformed bond blades and appropriate self sharpening ability by forming pores in the electroformed bond. It is now possible to process silicon + glass, silicon carbide (SiC) and other materials that have been difficult to cut with conventional electroformed bonds.


1. Reallizes one-pass processing of glass + Silicon wafer.

2. Realizes high-quality processing of silicon carbide (SiC) and other difficult-to-cut materials.

3. Two types available: standard and low concentration.

The blade Specifications:

The blade bond Abrasive Thehnics The blade thickness
Nickel Diamond Eletroplating 100~200μm
The blade precisiong Cutting material Abrasive size O.D.
10μm Silicon and glass 600~2000# 54.00~56.00mm

Slotting specification:

Number Width(mm) Depth(mm)
8 0.5 1
16 1 2
32 1.2 3

he cutting parameters:

Spindle rate Feed speed cut depth
30~50K/min 10~80mm/s 0.5~1.0mm

Contact us if you need more details on Porous Structue Electroplating. We are ready to answer your questions on packaging, logistics, certification or any other aspects about Composite Material Cutting、The Efficient Cutting. If these products fail to match your need, please contact us and we would like to provide relevant information.

Product Categories : The Blade Series > The Hubless Nickel Dicing Blade

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