BLFH series hubless Nickel Dicing Blade realize the ultra-thin cutting. The ultra-thin blade is produced by alkali corrosion of aluminum alloy to reduce the deformation. With high strength bond, the blade improve processing stability and reduce wavy cutting.
Electroformed Hubless Diamond Blade is a kind of ultra and precision Diamond Blade with excellent cutting ability, good and high efficiency, The Hubless Nickel Dicing Blade can select the different number of slots to cooling.
Sail-tech adopt the special Diamond dispersion technology to realize the Sandwich structure distribution of Diamond in the blade, the structure can reduce Narrow down of cutting and improve the life of blade.
Our company can product high precision hub blades to satisfy various commands from clients, the thickness tolerance was below 3μm. What`s more, the thickness ranges from 0.05 to 0.5mm.
Sail-tech can offer a full range of dicing blade for silicon wafer. Grit sizes, diamond concentrations, bond hardnesses, and hub configurations are optimized to deliver maximum cut quality, throughput and blade life.Contact us if you need more details on LED Board Dicing Blades. We are ready to answer your questions on packaging, logistics, certification or any other aspects about Ultra-Thin Saw Blades、Semiconductor Packaging Dicing Blades. If these products fail to match your need, please contact us and we would like to provide relevant information.