Find Pcb Dicing Blades, Bga Dicing Blades, Ceramic Dicing Blades on Industry Directory, Reliable Manufacturer/Supplier/Factory from China.

Home > Products > The Blade Series > The Hubless Nickel Dicing Blade > The Multifunction Hubless Nickel Dicing blade

The Multifunction Hubless Nickel Dicing blade

Product Description

These blades employ electroformed bonds that realize superb cutting quality and blade life.In addition to dicing semiconductor wafers, these blades are suitable for dicing a wide variety of semiconductor packages.


1. Deep cutting and grooving are possible using ultra-thin blades.

2. Blade thickness 0.015 mm to 0.3 mm.

3. Wide range of grit sizes and bond types are available to meet application requirements.

4. Available for both dicing saws and slicers.

The blade Specifications:

The blade bond Abrasive Thehnics The blade thickness
Nickel Diamond Eletroplating 15~300μm
The blade precisiong Cutting material Abrasive size O.D.
5μm Silicon Ceramics CSP 400-3000# 55.56~60.00mm

The cutting parameters:

Spindle rate Feed speed cut depth
30~50K/min 10~80mm/s 0.5~1.0mm

Contact us if you need more details on A Variety of Material Cutting. We are ready to answer your questions on packaging, logistics, certification or any other aspects about The Ultra-Thin Cutting、The Blade for Slotting. If these products fail to match your need, please contact us and we would like to provide relevant information.

Product Categories : The Blade Series > The Hubless Nickel Dicing Blade

Email to this supplier
  • *Subject:
  • To:

  • *Messages:
    Your message must be between 20-8000 characters