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Home > Products > The Blade Series > The Hubless Nickel Dicing Blade > The Multifunction Hubless Nickel Dicing blade

The Multifunction Hubless Nickel Dicing blade

Basic Info

Material: Diamond

Abrasive: Superabrasive

Shapes: Edge Shape

Types: Cutting Wheel

Cylindricity: <0.02

Circular Degree: <0.01

Technics: Electroplating

Working Style: Cutting

Product Description

These blades employ electroformed bonds that realize superb cutting quality and blade life.In addition to dicing semiconductor wafers, these blades are suitable for dicing a wide variety of semiconductor packages.

Features:

1. Deep cutting and grooving are possible using ultra-thin blades.

2. Blade thickness 0.015 mm to 0.3 mm.

3. Wide range of grit sizes and bond types are available to meet application requirements.

4. Available for both dicing saws and slicers.

The blade Specifications:

The blade bond Abrasive Thehnics The blade thickness
Nickel Diamond Eletroplating 15~300μm
The blade precisiong Cutting material Abrasive size O.D.
5μm Silicon Ceramics CSP 400-3000# 55.56~60.00mm

The cutting parameters:

Spindle rate Feed speed cut depth
30~50K/min 10~80mm/s 0.5~1.0mm




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Product Categories : The Blade Series > The Hubless Nickel Dicing Blade

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