These blades employ electroformed bonds that realize superb cutting quality and blade life.In addition to dicing semiconductor wafers, these blades are suitable for dicing a wide variety of semiconductor packages.
1. Deep cutting and grooving are possible using ultra-thin blades.
2. Blade thickness 0.015 mm to 0.3 mm.
3. Wide range of grit sizes and bond types are available to meet application requirements.
4. Available for both dicing saws and slicers.
The blade Specifications:
|The blade bond||Abrasive||Thehnics||The blade thickness|
|The blade precisiong||Cutting material||Abrasive size||O.D.|
|5μm||Silicon Ceramics CSP||400-3000#||55.56~60.00mm|
The cutting parameters:
|Spindle rate||Feed speed||cut depth|
|30~50K/min||10~80mm/s|| 0.5~1.0mm |