Shapes: Edge Shape
Types: Cutting Wheel
Circular Degree: <0.01
Working Style: Cutting
ALHN series hub Nickel Dicing Blade use the special surface treatment technology in plating substrates, the substrates can reach mirror surface,mechanical precision < 2μm. The blade have the few deflection and high cutting quality application.
The Diamond Blade with hub is with a stronger edge, which makes the blade more rigid and keep the edge not to be broken, so the cutting with the blade is in high efficiency and excellent quality.
Sail-tech adopt the special Diamond dispersion technology to realize the Sandwich structure distribution of Diamond in the blade, the structure can reduce Narrow down of cutting and improve the life of blade.
Our company can product high precision hub blades to satisfy various commands from clients, the thickness tolerance was below 3μm. What`s more, the thickness ranges from 0.05 to 0.5mm.
Sail-tech can offer a full range of dicing blade for silicon wafer. Grit sizes, diamond concentrations, bond hardnesses, and hub configurations are optimized to deliver maximum cut quality, throughput and blade life.Contact us if you need more details on Silicon Wafer Dicing Blades. We are ready to answer your questions on packaging, logistics, certification or any other aspects about The Gallium Arsenide Material、The Low Chipping. If these products fail to match your need, please contact us and we would like to provide relevant information.