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The Hub Nickel Dicing Blade for Copper

Basic Info

Material: Diamond

Abrasive: Superabrasive

Shapes: Edge Shape

Types: Cutting Wheel

Cylindricity: <0.02

Circular Degree: <0.05

Technics: Electroplating

Working Style: Cutting

Product Description

Hub Blades for Copper Wafer Dicing

Specially-formulated to resist loading when cutting copper-metallized wafers, the new CU Series hub blades reduce top and Back Side Chipping.


1. Available in 0.6 mil to 5.0 mil Thicknesses

2.Exposures of 15 mil to 60 mil

3.2-6 µm to 4-8 µm Diamond Grid

4.Specially-Formulated "CU" Series Bond Hardness and Grit Concentration

5.Available in AccuCut or Standard Hub, Both with AccuKerf Feature

The blade Specifications:

The blade bond Abrasive Thehnics The blade thickness
Nickel Diamond Eletroplating 35~200μm
The blade precisiong Cutting material Abrasive size O.D.
5μm Copper 3000~4500# 55.56mm

The cutting parameters:

Spindle rate Feed speed cut depth
30~50K/min 10~80mm/s 0.3~1.0mm

Contact us if you need more details on The Copper Cutting Blade. We are ready to answer your questions on packaging, logistics, certification or any other aspects about Preventing The Passivation Technology、Prevent The Chipping Blade. If these products fail to match your need, please contact us and we would like to provide relevant information.

Product Categories : The Blade Series > The Hub Nickel Dicing Blade

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