Company Details

  • Suzhou Sail Science & Technology Co., Ltd.

  •  [Jiangsu,China]
  • Business Type:Manufacturer
  • Main Mark: Americas , Asia , Europe , North Europe , Worldwide
  • Exporter:51% - 60%
  • Certs:ISO9001
  • Description:Fine Grinding of the Silicon Wafer,Thinning of the Silicon Wafer,Back Thinning for Silicon Wafer
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Suzhou Sail Science & Technology Co., Ltd.

Fine Grinding of the Silicon Wafer,Thinning of the Silicon Wafer,Back Thinning for Silicon Wafer

Silicon grinding wheels

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    Payment Type: T/T
    Incoterm: FOB,CIF,CIP
    Delivery Time: 10 Days

Basic Info

Material: Diamond

Abrasive: Superabrasive

Shapes: Section Shape

Types: Surface Grinding Wheel

Grain Size: 280#

Cylindricity: <0.02

Circular Degree: <0.01

Technics: Sinter

Working Style: Surface Grinding

Product Description

Silicon Grinding Wheels are mainly used for the thinning and fine grinding of the silicon wafer. These products

produced by our company,which possess superior grinding performance and high cost performance,are

among the top level worldwide. They are usually used for back thinning, grinding and fine grindingof monocrystalline silicon and some other Semiconductor Materials.

The ordering suggestion:

When first order, please provide the following parameters for the purpose of selecting the most suitable

wheels for you.

1. Drawings or detailed specification of the grinding wheels and wafer size.

2. Grinder model or grinding mode of the grinder.

3. Grinding allowance, in-feed rate, rotate speed of each spindle.

4. Precision requirements of work piece.




Looking for ideal Fine Grinding of the Silicon Wafer Manufacturer & supplier ? We have a wide selection at great prices to help you get creative. All the Thinning of the Silicon Wafer are quality guaranteed. We are China Origin Factory of Back Thinning for Silicon Wafer. If you have any question, please feel free to contact us.

Product Categories : Abrasion Wheels > Back Grinding Diamond Wheels

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  • Silicon grinding wheels
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