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Diamond Milling Grinding Wheel For Optical Glass

Basic Info

Model No.: SD3000

Product Description


Product Description

Diamond back Grinding Wheels for LED substrate are mainly used for back thinning of sapphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer. This kind of grinding wheel developed in out company can replace foreign products. They can be used steadily on Japanese, Korean grinders with high performance.

Main Features

Silicon back grinding wheel has the following features:

1. High efficiency

2. Sharp grinding

3. Long life span

4. Good surface quality

5. High cost performance

Application

Workpiece processed: sapphire epitaxial wafer, SiC Substrate epitaxial wafer, Si Substrate epitaxial wafer, gallium arsenide and GaN wafer.

Material of workpiece: Synthetic sapphire, SiC, single crystal silicon.

Grinders: SHUWA, NTS, WEC, GALAXY, SPEEDFAM.

Packaging & Shipping

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Contact us if you need more details on Diamond Milling Grinding Wheels. We are ready to answer your questions on packaging, logistics, certification or any other aspects about High Performance Diamond Back Grinding Wheels、High Quality Diamond Back Grinding Wheel For Silicon Slice Thinn. If these products fail to match your need, please contact us and we would like to provide relevant information.

Product Categories : Abrasion Wheels > Back Grinding Diamond Wheels

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