Diamond back Grinding Wheels for LED substrate are mainly used for back thinning of sapphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer. This kind of grinding wheel developed in out company can replace foreign products. They can be used steadily on Japanese, Korean grinders with high performance.
Silicon back grinding wheel has the following features:
1. High efficiency
2. Sharp grinding
3. Long life span
4. Good surface quality
5. High cost performance
Workpiece processed: sapphire epitaxial wafer, SiC Substrate epitaxial wafer, Si Substrate epitaxial wafer, gallium arsenide and GaN wafer.
Material of workpiece: Synthetic sapphire, SiC, single crystal silicon.
Grinders: SHUWA, NTS, WEC, GALAXY, SPEEDFAM.
Packaging & Shipping