Grinding Wheel For Back Thinning

Advantage:

Minimized wafer edge chipping/improved die strength,Excellent grinding ablity with high feed/Applicable thin wafer

Sail series Grinding Wheels employ a new porous vitrified bond with excellent swarf removal capability as well, the new bond feeds in the wheel coolant water in order to grind extremely hard SiC wafers. Grinding with a fixed abrasive produces a surface roughness approaching a polish. Grinding can be performed on tape mounted wafers making it unnecessary to use wafer carriers. The total process is much easier compared to a slurry processes

Sail series grinding wheels

1. excllent quality.

2, steady working
3. long life time.
4. high performance

Specification:

Contact us if you need more details on Grinding Wheel For Silicon Slice. We are ready to answer your questions on packaging, logistics, certification or any other aspects about Sapphair Epitaxial Wafer Grinding Wheel、Metal Bond Super Thin Wheels. If these products fail to match your need, please contact us and we would like to provide relevant information.

Product Categories : Abrasion Wheels > Back Grinding Diamond Wheels