Company Details
Suzhou Sail Science & Technology Co., Ltd.
Grinding Wheel For Silicon Slice,Sapphair Epitaxial Wafer Grinding Wheel,Metal Bond Super Thin Wheels
Company Details
Suzhou Sail Science & Technology Co., Ltd.
Grinding Wheel For Silicon Slice,Sapphair Epitaxial Wafer Grinding Wheel,Metal Bond Super Thin Wheels
| Payment Type: | T/T |
|---|---|
| Incoterm: | FOB,CIF,CIP |
| Min. Order: | 30 Bag/Bags |
| Delivery Time: | 15 Days |
Model No.: SD3500
Type: Die Grinder
Power Source: Electricity
Object: Turning Tool
Application: Construction
Disc(Wheel) Type: Grinding Disc
Material: Metal
Working Style: High-speed universal
Disc Diameter: 230mm
Variable Speed: With Variable Speed
Product Name: Back Drinding Wheel
Applications: Silicon Wafer
Abrasive: SD Synthetic
Grit: 270-8000
Bond: Metal,Vitrified,Resin
OD: 200~304
Width: 2-7MM
Packaging: Bags or Cartons
Productivity: 1200PCS PER MONTH
Brand: SAIL-TECH
Place of Origin: SUZHOU INDUSTRIAL PARK
Supply Ability: 300PCS PER WEEK
Certificate: ISO9001:2008
HS Code: 8202391000
Port: Shanghai Airport,Shanghai Seaport
Advantage:
Minimized wafer edge chipping/improved die strength,Excellent grinding ablity with high feed/Applicable thin wafer
Sail series Grinding Wheels employ a new porous vitrified bond with excellent swarf removal capability as well, the new bond feeds in the wheel coolant water in order to grind extremely hard SiC wafers. Grinding with a fixed abrasive produces a surface roughness approaching a polish. Grinding can be performed on tape mounted wafers making it unnecessary to use wafer carriers. The total process is much easier compared to a slurry processes
Sail series grinding wheels
1. excllent quality.
2, steady working
3. long life time.
4. high performance
Specification:
Product Categories : Abrasion Wheels > Back Grinding Diamond Wheels
