Basic Info
Model No.: SD3500
Type: Die Grinder
Power Source: Electricity
Object: Turning Tool
Application: Construction
Disc(Wheel) Type: Grinding Disc
Material: Metal
Working Style: High-speed universal
Disc Diameter: 230mm
Variable Speed: With Variable Speed
Product Name: Back Drinding Wheel
Applications: Silicon Wafer
Abrasive: SD Synthetic
Grit: 270-8000
Bond: Metal,Vitrified,Resin
OD: 200~304
Width: 2-7MM
Product Description
Advantage:
Minimized wafer edge chipping/improved die strength,Excellent grinding ablity with high feed/Applicable thin wafer
Sail series Grinding Wheels employ a new porous vitrified bond with excellent swarf removal capability as well, the new bond feeds in the wheel coolant water in order to grind extremely hard SiC wafers. Grinding with a fixed abrasive produces a surface roughness approaching a polish. Grinding can be performed on tape mounted wafers making it unnecessary to use wafer carriers. The total process is much easier compared to a slurry processes
Sail series grinding wheels
1. excllent quality.
2, steady working
3. long life time.
4. high performance
Specification:
Product Categories : Abrasion Wheels > Back Grinding Diamond Wheels