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Basic Info

Model No.: SD3500

Type: Die Grinder

Power Source: Electricity

Object: Turning Tool

Application: Construction

Disc(Wheel) Type: Grinding Disc

Material: Metal

Working Style: High-speed universal

Disc Diameter: 230mm

Variable Speed: With Variable Speed

Product Name: Back Drinding Wheel

Applications: Silicon Wafer

Abrasive: SD Synthetic

Grit: 270-8000

Bond: Metal,Vitrified,Resin

OD: 200~304

Width: 2-7MM

Product Description


Minimized wafer edge chipping/improved die strength,Excellent grinding ablity with high feed/Applicable thin wafer

Sail series Grinding Wheels employ a new porous vitrified bond with excellent swarf removal capability as well, the new bond feeds in the wheel coolant water in order to grind extremely hard SiC wafers. Grinding with a fixed abrasive produces a surface roughness approaching a polish. Grinding can be performed on tape mounted wafers making it unnecessary to use wafer carriers. The total process is much easier compared to a slurry processes


Sail series grinding wheels

1. excllent quality.

2, steady working
3. long life time.
4. high performance


Contact us if you need more details on Grinding Wheel For Silicon Slice. We are ready to answer your questions on packaging, logistics, certification or any other aspects about Sapphair Epitaxial Wafer Grinding Wheel、Metal Bond Super Thin Wheels. If these products fail to match your need, please contact us and we would like to provide relevant information.

Product Categories : Abrasion Wheels > Back Grinding Diamond Wheels

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