Company Details

  • Suzhou Sail Science & Technology Co., Ltd.

  •  [Jiangsu,China]
  • Business Type:Manufacturer
  • Main Mark: Americas , Asia , Europe , North Europe , Worldwide
  • Exporter:51% - 60%
  • Certs:ISO9001
  • Description:Sail Resin Dicing Bond,BIA Resin Bonded Blade,Glass Dicing Soln Resinoid Blade
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Suzhou Sail Science & Technology Co., Ltd.

Sail Resin Dicing Bond,BIA Resin Bonded Blade,Glass Dicing Soln Resinoid Blade

Home > Products > Sail Blade Series > Sail Series BIA Resin Bonded Blade

Sail Series BIA Resin Bonded Blade

Product categories of Sail Series BIA Resin Bonded Blade, we are specialized manufacturers from China, Sail Resin Dicing Bond, BIA Resin Bonded Blade suppliers/factory, wholesale high-quality products of Glass Dicing Soln Resinoid Blade R & D and manufacturing, we have the perfect after-sales service and technical support. Look forward to your cooperation!
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Super Resin Bond Dicing Blade

Model No. : SB1M8

Resin bond blade has rich elasticity and good self-sharpening,resin bond blade is widely used in sigulation field of semiconductor packing meterials and optical materials.A series of bonds in our company can meet different cutting...

China Sail Resin Dicing Bond of with CE
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1A8 Resin Bond Dicing Blade

Model No. : B1A8

Vaccum Brazed diamond saw blade Resin Bond Blade Resin bond blade has Rich elasticity and good self-sharpening, it is widely used in singulation field of semiconductor packaging materials and optical materials. A series of bonds in our company can...

China Manufacturer of BIA Resin Bonded Blade
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Ultra Thin Diamond Cutting Blade

The new series blade realizes high-grade processing of hard, brittle materials, such as optical glass materials. It also has a wide range of bonds to support various needs. These new blades have Sharp cutting edges, achieve small chipping for both...

High Quality Glass Dicing Soln Resinoid Blade China Supplier
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Resin bond diamond cutting wheel for cemented carbide

Model No. : BIA8SDC1000N

High-precision cutting wheels Sintered metal powder is used as the bonding agent material to realize strong holding power.As a result,these blades have low blade wear.They are excellent for accurate cutting or grooving of electronic devices such as...

High Quality Sail Resin Dicing Bond China Factory
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Ultra Thin Diamond Dicing Blade For PQFN/QFN

Model No. : BIM8SDC400N

Resin Bond Dicing Saws for QFN Product Features 1. Sharp

China Supplier of BIA Resin Bonded Blade
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Resin bond Dicing Saws for QFN

Model No. : BIA8SDC200N

Resin Bond Dicing Saws for QFN Resin bond blade has Rich elasticity and good self-sharpening, it is widely used in singulation field of semiconductor packaging materials and optical materials. A series of bonds in our company can meet different...

China Factory of Glass Dicing Soln Resinoid Blade
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Ultra-thin Resin-bond Dicing Blade

Model No. : B1A810

Vaccum Brazed diamond saw blade Resin Bond Blade Resin bond blade has Rich elasticity and good self-sharpening, it is widely used in singulation field of semiconductor packaging materials and optical materials. A series of bonds in our company can...

Sail Resin Dicing Bond Made in China
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Super resin bond dicing blades

Model No. : B1A8

Originated specially banding composition,sail resin bond blades realize high process quality and efficient processing in diverse application from semiconductor package to high brittle maaterials like crystalline quartz. Processing objects...

Professional Manufacturer of BIA Resin Bonded Blade
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Glass Dicing Soln Resinoid Blade

Model No. : B1N8

Vaccum Brazed diamond saw blade Resin Bond Blade Resin bond blade has Rich elasticity and good self-sharpening, it is widely used in singulation field of semiconductor packaging materials and optical materials. A series of bonds in our company can...

Leading Manufacturer of Glass Dicing Soln Resinoid Blade
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Diamond Cutting Blades for Cutting

Model No. : BIA8

Vaccum Brazed diamond saw blade Resin Bond Blade Resin bond blade has Rich elasticity and good self-sharpening, it is widely used in singulation field of semiconductor packaging materials and optical materials. A series of bonds in our company can...

Professional Supplier of Sail Resin Dicing Bond
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1A8 Resin Bond Diamond Blades

Model No. : B1AB

We specialized in the research, development, production and sales of ultra precision diamond and CBN tools used in the industry of semiconductor. The products of resin bonded, metal bonded and electrodeposit ultra-thin and ultra-precision diamond...

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Resin bond diamond wheel

Model No. : SD300

Resin Bond Diamond/CBN grinding wheel Specifications 1. Diameter: 50-350mm available 2. Diamond grit: #100, #150, #200, #300, #400, or upon your request 3. Thickness:10mm-40mm, other size is avaliable 4. Hole size:20mm,25.4mm,30mm, or as your...

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Slotted grinding resin bond wheel

This type of wheel is mainly used for fine grinding in optical glass industry. With high efficiency and cost effective, it is mainly used for back thinning of optical glass, GaN wafer. Feathers: 1.Good self-sharpening performance and good elasticity...

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Sail BIA Resin bonded Blades

Model No. : B1A8

Resin bond blade has rich elasticity and good self-sharpening,resin bond blade is widely used in sigulation field of semiconductor packing meterials and optical materials.A series of bonds in our company can meet different cutting...

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Resin bond blade For DFN Materials

Model No. : SB1N8

Resin bond blade has rich elasticity and good self-sharpening,resin bond blade is widely used in sigulation field of semiconductor packing meterials and optical materials.A series of bonds in our company can meet different cutting...

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Resin Bond Blade for BGA

Model No. : SB1V8

Resin bond blade has rich elasticity and good self-sharpening,resin bond blade is widely used in sigulation field of semiconductor packing meterials and optical materials.A series of bonds in our company can meet different cutting...

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Series BIA Resin Bonded Blade

Model No. : SB1A8

Resin bond blade has rich elasticity and good self-sharpening,resin bond blade is widely used in sigulation field of semiconductor packing meterials and optical materials.A series of bonds in our company can meet different cutting...

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China Sail Series BIA Resin Bonded Blade Suppliers

Resin Bond Blade

Resin bond blade has Rich elasticity and good self-sharpening, it is widely used in singulation field of semiconductor packaging materials and optical materials. A series of bonds in our company can meet different cutting requirements. What`s more, we can provide customers service for different specifications and types according their needs.

Product characteristics

1. new bond will be developed according to processing materials ;

2. customer can customize blades of different specifications and work performance

3. New hot pressing molding technology ensures product quality stability

Processing objects

QFN.Optical Glass.ceramic materials ect.

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