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Resin bond diamond cutting wheel for cemented carbide

Basic Info

Model No.: BIA8SDC1000N

Material: Diamond

Abrasive: Superabrasive

Shapes: Edge Shape

Types: Surface Grinding Wheel

Grain Size: 100#, 170#-1200#

Cylindricity: <0.1

Circular Degree: <0.1

Technics: Electroplating

Working Style: Surface Grinding

Place Of Origin: Suzhou, China (Mainland)

Brand Name: Sail

Type: Metal Saw Blade

Blade Material: Diamond

Finishing: DIAMOND

Size: 52-150mm

Usage: Cutting And Slotting

Name: 1A8 Metal Bond Dicing Blade For Semiconductor Comp

Cutting Material: QFN,PQFN,optical Glass,quartz,ceramic,carbide

Product Description

High-precision cutting wheels

Sintered metal powder is used as the bonding agent material to realize strong holding power.As a result,these blades have low blade wear.They are excellent for accurate cutting or grooving of electronic devices such as csp packages,ceramics and optical materials

Features:

Excellent rigidity,high wear resistance,long life and low risk of wavy cutting.

Applications:

Optical Glass, ceramics, ferrite, crystals, etc.

Resin Bond Diamond Cutting Wheel For Dfn



If you have any questions or requirements, please feel free to contact me!

contact name :Mary wu

whatsapp:0086 13776077256

skype :+8613776077256

TEL:+86-13776077256

website: http://www.sail-abrasives.com/



Contact us if you need more details on Resin Bond Diamond Cutting Wheel for Cemented Carbide. We are ready to answer your questions on packaging, logistics, certification or any other aspects about Resin Bond Diamond Cutting Wheel for QFN、Resin Bond Diamond Cutting Wheel for DFN. If these products fail to match your need, please contact us and we would like to provide relevant information.

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