Model No.: BIA8SDC1000N
Shapes: Edge Shape
Types: Surface Grinding Wheel
Grain Size: 100#, 170#-1200#
Circular Degree: <0.1
Working Style: Surface Grinding
Place Of Origin: Suzhou, China (Mainland)
Brand Name: Sail
Type: Metal Saw Blade
Blade Material: Diamond
Usage: Cutting And Slotting
Name: 1A8 Metal Bond Dicing Blade For Semiconductor Comp
Cutting Material: QFN,PQFN,optical Glass,quartz,ceramic,carbide
High-precision cutting wheels
Sintered metal powder is used as the bonding agent material to realize strong holding power.As a result,these blades have low blade wear.They are excellent for accurate cutting or grooving of electronic devices such as csp packages,ceramics and optical materials
Excellent rigidity,high wear resistance,long life and low risk of wavy cutting.
Optical Glass, ceramics, ferrite, crystals, etc.
If you have any questions or requirements, please feel free to contact me!
contact name :Mary wu