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Home > Products > Sail Blade Series > Sail Series BIA Resin Bonded Blade > Ultra Thin Diamond Dicing Blade For PQFN/QFN

Ultra Thin Diamond Dicing Blade For PQFN/QFN

Basic Info

Model No.: BIM8SDC400N

Material: Diamond

Abrasive: Superabrasive

Shapes: Edge Shape

Types: Surface Grinding Wheel

Grain Size: 100#, 170#-1200#

Cylindricity: <0.1

Circular Degree: <0.1

Technics: Electroplating

Working Style: Surface Grinding

Place Of Origin: Suzhou, China (Mainland)

Brand Name: Sail

Type: Resin Saw Blade

Blade Material: Diamond

Finishing: DIAMOND

Size: 52-150mm

Usage: Cutting And Slotting

Name: 1A8 Resin Bond Dicing Blade For Semiconductor Comp

Cutting Material: QFN,PQFN,optical Glass,quartz,ceramic,carbide

Product Description

Resin Bond Dicing Saws for QFN

Product Features

1. Sharp cutting;

2. High precision cutting;

3. Elastic bond;

4. Good-quality surface processing;

5. Wide range of application;

6. Various specifications and sizes;

7. Short supply cycle.

Product Description

The dicing blades without steel core are made from diamond or cubic boron nitride and bonded with resin through special processes. Such blades are mainly used for cutting with high precision and slotting semiconductor components, optical glasses, quartz glasses, ceramics, and other precision components.

Packaging & Shipping


Contact us if you need more details on Ultra Thin Diamond Cutting Blades For Glasses. We are ready to answer your questions on packaging, logistics, certification or any other aspects about Ultra Thin Diamond Dicing Blade For PQFN/QFN、Ultra Thin Diamond Dicing Blade For Ceramics. If these products fail to match your need, please contact us and we would like to provide relevant information.

Product Categories : Sail Blade Series > Sail Series BIA Resin Bonded Blade

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