1A8 Resin Bond Diamond Blades
Basic Info
Model No.: B1AB
Product Description
We specialized in the research, development, production and sales of ultra precision diamond and CBN tools used in the industry of semiconductor.
The products of resin bonded, metal bonded and electrodeposit ultra-thin and ultra-precision diamond wheels made by the company have been widely used in cutting, slotting, dicing, wafering, back-thinning, CMP, array TEG, PCB and other precision processing in the industry of semiconductor.
Also the products are used for the precision processing of hard and fragile materials, such as quartz, glass, ceramics, etc.
The products of resin bonded, metal bonded and electrodeposit ultra-thin and ultra-precision diamond wheels made by the company have been widely used in cutting, slotting, dicing, wafering, back-thinning, CMP, array TEG, PCB and other precision processing in the industry of semiconductor.
Also the products are used for the precision processing of hard and fragile materials, such as quartz, glass, ceramics, etc.
Product Categories : Sail Blade Series > Sail Series BIA Resin Bonded Blade
Other Products
Hot Products
Single sand surface trimming grinding headCNC Single Sand Trimming Grinding HeadDual Punch Appearance DrillDual Grit Hole Shape GrindingElectroplated Grinding Wheel for Grinding GlassSingle Grit Camber Drillsingle grit core drillElectroplated Grinding Wheel for Magnetic MaterialsSilicon grinding wheelsSharp Resin Bond BladeUltra-thin resin bond bladeThe High Precision and Superthin Hubless BladeMetal Sintered Dicing BladesA hub nickel Dicing blade for SiliconResin bond grinding wheel40μm Ultra Thin Dicing Blade