Model No.: B1AB
Shapes: Section Shape
Types: Surface Grinding Wheel
Grain Size: 280#
Circular Degree: <0.01
Working Style: Surface Grinding
The products of resin bonded, metal bonded and electrodeposit ultra-thin and ultra-precision diamond wheels made by the company have been widely used in cutting, slotting, dicing, wafering, back-thinning, CMP, array TEG, PCB and other precision processing in the industry of semiconductor.
Also the products are used for the precision processing of hard and fragile materials, such as quartz, glass, ceramics, etc.