Find Sail Resin Dicing Bond, BIA Resin Bonded Blade, Glass Dicing Soln Resinoid Blade on Industry Directory, Reliable Manufacturer/Supplier/Factory from China.

Basic Info

Model No.: B1AB

Material: Diamond

Abrasive: Superabrasive

Shapes: Section Shape

Types: Surface Grinding Wheel

Grain Size: 280#

Cylindricity: <0.02

Circular Degree: <0.01

Technics: Sinter

Working Style: Surface Grinding

Product Description

We specialized in the research, development, production and sales of ultra precision diamond and CBN tools used in the industry of semiconductor.
The products of resin bonded, metal bonded and electrodeposit ultra-thin and ultra-precision diamond wheels made by the company have been widely used in cutting, slotting, dicing, wafering, back-thinning, CMP, array TEG, PCB and other precision processing in the industry of semiconductor.
Also the products are used for the precision processing of hard and fragile materials, such as quartz, glass, ceramics, etc.

Contact us if you need more details on Resin Bond Diamond Blades. We are ready to answer your questions on packaging, logistics, certification or any other aspects about 1A8 Resin Bond Diamond Blade、Resin Bond Diamond Blades for Optical Glass. If these products fail to match your need, please contact us and we would like to provide relevant information.

Product Categories : Sail Blade Series > Sail Series BIA Resin Bonded Blade

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