Model No.: BIA8SDC200N
Resin Bond Dicing Saws for QFN
Resin Bond Blade has Rich elasticity and good self-sharpening, it is widely used in singulation field of semiconductor packaging materials and optical materials. A series of bonds in our company can meet different cutting requirements. What`s more, we can provide customers service for different specifications and types according their needs.
1. new bond will be developed according to processing materials ;
2. customer can customize blades of different specifications and work performance
3. New hot pressing molding technology ensures product quality stability
QFN.Optical Glass.ceramic materials ect.
1.Long life and stable performance
2.Good cutting result and high efficiency
3.Produce all kinds of specifications
4.Any package upon request
5.Delivery on time
6.Accept small quantity orders