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Resin bond Dicing Saws for QFN

Basic Info

Model No.: BIA8SDC200N

Product Description

Resin Bond Dicing Saws for QFN

Resin Bond Dicing Blade700082195023630720

Resin Bond Blade has Rich elasticity and good self-sharpening, it is widely used in singulation field of semiconductor packaging materials and optical materials. A series of bonds in our company can meet different cutting requirements. What`s more, we can provide customers service for different specifications and types according their needs.

Product characteristics

1. new bond will be developed according to processing materials ;

2. customer can customize blades of different specifications and work performance

3. New hot pressing molding technology ensures product quality stability

Processing objects

QFN.Optical Glass.ceramic materials ect.



Features:

1.Long life and stable performance

2.Good cutting result and high efficiency

3.Produce all kinds of specifications

4.Any package upon request

5.Delivery on time

6.Accept small quantity orders



Contact us if you need more details on Resin Bond Dicing Saws for QFN. We are ready to answer your questions on packaging, logistics, certification or any other aspects about Resin Bond Dicing Saws for DFN、Resin-bond Blades. If these products fail to match your need, please contact us and we would like to provide relevant information.

Product Categories : Sail Blade Series > Sail Series BIA Resin Bonded Blade

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