Suzhou Sail Science & Technology Co., Ltd.
Electroformed bond:The Hub Blade mix metal nickel bond and diamod by electroforming method, the bond have the strong abrasion and high life.
Diamond Dicing Tools:The Hub Blade cut materrial by the sharp diamond, The diamond cutting have the high efficiency and quality in man applications.
The Silicon Wafer Dicing Blades: The Hub Nickel Dicing Blade can be widely used in Silicon wafer Dicing, Silicon wafer Dicing require the narrow kerf and less chipping, with the fine diamond and ultra-thin, the blade can satisfy the cutting requirements.
*Both can High-speed Dicing.
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