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The Hub Nickel Dicing Blade

Product categories of The Hub Nickel Dicing Blade, we are specialized manufacturers from China, The Silicon Wafer Dicing Blades, Diamond Dicing Tools suppliers/factory, wholesale high-quality products of The Hub Blade R & D and manufacturing, we have the perfect after-sales service and technical support. Look forward to your cooperation!
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Diamond Wafer Hub Dicing Blade
Brand:SAIL-TECH
Packaging:bags and carton
Certificate:ISO9001:2015
metal bond diamond dicing blades for cutting ceremic Packaging & Delivery Packaging Details:Plastic box. Diamond Dicing Blades By employing new technologies and imported facilities, Sail company produce series electroplated bond blade with Hub is our company`s high level product. A combination of an ultra-thin...
Nickcle Hub Dicing Saws
Packaging:bags and cartons
Model No.:ATN-BC-AA
SuZhou Sail technology co.,LTD uses the advanced electroplating process and unique diamond dispersion technology,can make the hub blade of different specifications,hardness and concentration,the different craft and formula are used for different customers. We can effectively improve the quality and life of the dicing...
The High Quality Hub Nickel Dicing Blade
The back chipping is a problem in the hub nickel Dicing blade, the series blade solve the problem thought reducing the strength of bond and the content of diamond. Features: 1. This series blade designed for hard brittle material to solve the back chipping. 2. A normal cutting life in the high quality cutting. 3.Many...
The Hub Nickel Dicing Blade for Ceramic
Packaging:bags or package
Model No.:ATN-BC-AA
This series blade have the strong cutting ability by adding grinding of force of abrasive. The blade have a high quality and a high life cutting in Ceramic. Features: 1.designed for Ceramic cutting. 2.Make the Continuous Cutting by self-lubricating bond and keep the high quality cutting. 3.Different thickness for...
The Ultra-thin Bub Nickel Dicing Blade
This series blade realize the cutting less than 20μm in order to satisfy the Ultra-thin cutting of high-end clients. The blade solve wavy cutting though high strength bond and low temperature treatment. Features: 1. The hub nickel Dicing blade can achieve the high quality and the high life cutting. 2. According to...
The Hub Nickel Dicing Blade by Slotting
The series blade is designed for cooling in cutting PCB BGA and Ceramic material. By slotting the blade reduce the cutting temperatue, as the same time increase the cutting speed. Features: 1.Different number and specifications of slotting for different material cutting. 2. Reducing the cutting temperature...
The High Precision Hubless Nickel Dicing blade
The series Blade adopt grind process to control the mechanical precision, up to 2μm. By the grind process the surface of blade is smoothed effectively, so the quality of cutting get promotion. Features: 1.According to customer demand to provide different precision blade. 2.High quality cutting in different materials....
The Hub Nickel Dicing Blade for Copper
Hub Blades for Copper Wafer Dicing Specially-formulated to resist loading when cutting copper-metallized wafers, the new CU Series hub blades reduce top and back side chipping. Features: 1. Available in 0.6 mil to 5.0 mil Thicknesses 2.Exposures of 15 mil to 60 mil 3.2-6 µm to 4-8 µm Diamond Grid...
A hub nickel Dicing blade for Silicon
ALHN series hub nickel Dicing blade use the special surface treatment technology in plating substrates, the substrates can reach mirror surface,mechanical precision < 2μm. The blade have the few deflection and high cutting quality application. The diamond blade with hub is with a stronger edge, which makes the...
The Hub Nickel Dicing Blade for QFN
QFN materials usually use the blalde with metal bond and resin bond, The quality of cutting in the Nickel blade can not meet the need of client. We solve this proble through optimizing the process and formula and adding the slotting. The hub nickel dicing blade in cutting QFN have a long life than the metal bond and...
The hub nickel Dicing blade for Silicon
The hub nickel Dicing blade of ALHN series design for Silicon cutting. the blade use the special surface treatment technology in plating substrates, the substrates can reach mirror surface, mechanical precision < 2μm. The blade have the few deflection and high cutting quality application for Silicon cutting. The...
The hub nickel Dicing blade for PCB
Under the premise of ensuring The cutting quality, By improving the strength bond and content of diamond , the ASTN series hub nickel Dicing blade realize the long life for cutting the Printed Circuit Board Dicing material. The diamond blade with hub is with a stronger edge, which makes the blade more rigid and keep...
The Angle Hub Nickel Dicing Blade
With the slotting in different material, We manufacture the the Hub Nickel Dicing Blade in different angle to meet customer requirements. Features: 1. According to customer demand to provide different shape and angle blade. 2. This series offers shorter precut times and lower chance of blade breakage due to flying...
China The Hub Nickel Dicing Blade Suppliers

Electroformed bond:The Hub Blade mix metal nickel bond and diamod by electroforming method, the bond have the strong abrasion and high life.

Diamond Dicing Tools:The Hub Blade cut materrial by the sharp diamond, The diamond cutting have the high efficiency and quality in man applications.

The Silicon Wafer Dicing Blades: The Hub Nickel Dicing Blade can be widely used in Silicon wafer Dicing, Silicon wafer Dicing require the narrow kerf and less chipping, with the fine diamond and ultra-thin, the blade can satisfy the cutting requirements.

*Both can High-speed Dicing.