Find The Silicon Wafer Dicing Blades, Diamond Dicing Tools, The Hub Blade on Industry Directory, Reliable Manufacturer/Supplier/Factory from China.

Home > Products > The Blade Series > The Hub Nickel Dicing Blade > The Ultra-thin Bub Nickel Dicing Blade

The Ultra-thin Bub Nickel Dicing Blade

Basic Info

Material: Diamond

Abrasive: Superabrasive

Shapes: Edge Shape

Types: Cutting Wheel

Cylindricity: <0.02

Circular Degree: <0.01

Technics: Electroplating

Working Style: Cutting

Product Description

This series blade realize the cutting less than 20μm in order to satisfy the Ultra-thin cutting of high-end clients. The blade solve wavy cutting though high strength bond and low temperature treatment.


1. The Hub Nickel Dicing Blade can achieve the high quality and the high life cutting.

2. According to customer damand, provide the blade in 10~20μm.

3. The cutting speed more than 80mm/s.


The blade Specifications:

The blade bond Abrasive Thehnics The blade thickness
Nickel Diamond Eletroplating 15~20μm
The blade precisiong Cutting material Abrasive size O.D.
3μm Silicon GaAs Gap 3000~4500# 55.56mm

The cutting parameters:

Spindle rate Feed speed cut depth
40~50K/min 60~120mm/s <0.3mm

Contact us if you need more details on The Ultra-thin Blade. We are ready to answer your questions on packaging, logistics, certification or any other aspects about The High Speed Cutting、Silicon Wafer Cutting. If these products fail to match your need, please contact us and we would like to provide relevant information.

Product Categories : The Blade Series > The Hub Nickel Dicing Blade

Email to this supplier
  • *Subject:
  • To:

  • *Messages:
    Your message must be between 20-8000 characters