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The hub nickel Dicing blade for Silicon

Product Description

The Hub Nickel Dicing Blade of ALHN series design for Silicon cutting. the blade use the special surface treatment technology in plating substrates, the substrates can reach mirror surface, mechanical precision < 2μm. The blade have the few deflection and high cutting quality application for Silicon cutting.

The blade parameters:

The blade bond: Nickel abrasive: Diamond

Technics: Electroplating The blade thickness: 20~35μm

The blade precision:±3μm Cutting material: Silicon

Spindle rate: 30K/min Feed speed:60~80mm/s

Cut depth:<0.3mm

The blade features:

1.High precision cutting.

2.High quality cutting.

3.High strength blade.

4.A Wide Range of Grit Sizes

5.Choose From many Diamond Concentrations

Silicon cutting

The hub nickel Dicing blade 2

The hub nickel Dicing blade3

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