The Hub Nickel Dicing Blade of ALHN series design for Silicon cutting. the blade use the special surface treatment technology in plating substrates, the substrates can reach mirror surface, mechanical precision < 2μm. The blade have the few deflection and high cutting quality application for Silicon cutting.
The blade parameters:
The blade bond: Nickel abrasive: Diamond
Technics: Electroplating The blade thickness: 20~35μm
The blade precision:±3μm Cutting material: Silicon
Spindle rate: 30K/min Feed speed:60~80mm/s
The blade features:
1.High precision cutting.
2.High quality cutting.
3.High strength blade.
4.A Wide Range of Grit Sizes
5.Choose From many Diamond Concentrations