The series Blade adopt grind process to control the mechanical precision, up to 2μm. By the grind process the surface of blade is smoothed effectively, so the quality of cutting get promotion.
1.According to customer demand to provide different precision blade.
2.High quality cutting in different materials.
3.Realizes highly straight processing and increases the process speed thanks to the high strength bond.
The blade Specifications:
|The blade bond||Abrasive||Thehnics||The blade thickness|
|The blade precisiong||Cutting material||Abrasive size||O.D.|
|2μm||Silicon PCB ceramics||600~3000#||55.56~60.00mm|
The cutting parameters:
|Spindle rate||Feed speed||cut depth|