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1A8 Resin Bond Dicing Blade

Basic Info

Model No.: B1A8

Product Description

Vaccum Brazed Diamond Saw Blade

Resin Bond Blade

Resin bond blade has Rich elasticity and good self-sharpening, it is widely used in singulation field of semiconductor packaging materials and optical materials. A series of bonds in our company can meet different cutting requirements. What`s more, we can provide customers service for different specifications and types according their needs.

Product characteristics

1. new bond will be developed according to processing materials ;

2. customer can customize blades of different specifications and work performance

3. New hot pressing molding technology ensures product quality stability

8fca2c82d810799a837a08ba9fProcessing objects

QFN.Optical Glass.ceramic materials ect.


1.Long life and stable performance

2.Good cutting result and high efficiency

3.Produce all kinds of specifications

4.Any package upon request

5.Delivery on time

6.Accept small quantity orders

Contact us if you need more details on Resin Bond Dicing Blade. We are ready to answer your questions on packaging, logistics, certification or any other aspects about 1A8 Resin Bond Dicing Blade for Semiconductor、Diamond Cutting Wheel. If these products fail to match your need, please contact us and we would like to provide relevant information.

Product Categories : Sail Blade Series > Sail Series BIA Resin Bonded Blade

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