Company Details

  • Suzhou Sail Science & Technology Co., Ltd.

  •  [Jiangsu,China]
  • Business Type:Manufacturer
  • Main Mark: Americas , Asia , Europe , North Europe , Worldwide
  • Exporter:51% - 60%
  • Certs:ISO9001
  • Description:Resin Bond Dicing Blade,1A8 Resin Bond Dicing Blade for Semiconductor,Diamond Cutting Wheel
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Suzhou Sail Science & Technology Co., Ltd.

Resin Bond Dicing Blade,1A8 Resin Bond Dicing Blade for Semiconductor,Diamond Cutting Wheel

1A8 Resin Bond Dicing Blade

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    Unit Price: USD 10 - 50 / Bag/Bags
    Payment Type: L/C,T/T
    Incoterm: FOB,CIF,CPT
    Min. Order: 10 Bag/Bags
    Delivery Time: 15 Days

Basic Info

Model No.: B1A8

Material: Diamond

Abrasive: Superabrasive

Shapes: Edge Shape

Types: Surface Grinding Wheel

Grain Size: 100#, 170#-1200#

Cylindricity: <0.1

Circular Degree: <0.1

Technics: Electroplating

Working Style: Surface Grinding

Place Of Origin: Suzhou, China (Mainland)

Brand Name: Sail

Type: Resin Saw Blade

Blade Material: Diamond

Finishing: DIAMOND

Size: 52-150mm

Usage: Cutting And Slotting

Name: 1A8 Resin Bond Dicing Blade For Semiconductor Comp

Cutting Material: QFN,PQFN,optical Glass,quartz,ceramic,carbide

Additional Info

Packaging: Bags or Cartons

Productivity: 1200PCS PER MONTH

Brand: SAIL-TECH

Transportation: Ocean,Air

Place of Origin: SUZHOU INDUSTRIAL PARK

Supply Ability: 300PCS PER WEEK

Certificate: ISO9001:2008

HS Code: 8202391000

Port: Shanghai Airport,Shanghai Seaport

Product Description




Vaccum Brazed Diamond Saw Blade


Resin Bond Blade

Resin bond blade has Rich elasticity and good self-sharpening, it is widely used in singulation field of semiconductor packaging materials and optical materials. A series of bonds in our company can meet different cutting requirements. What`s more, we can provide customers service for different specifications and types according their needs.

Product characteristics

1. new bond will be developed according to processing materials ;

2. customer can customize blades of different specifications and work performance

3. New hot pressing molding technology ensures product quality stability

8fca2c82d810799a837a08ba9fProcessing objects

QFN.Optical Glass.ceramic materials ect.



Features:

1.Long life and stable performance

2.Good cutting result and high efficiency

3.Produce all kinds of specifications

4.Any package upon request

5.Delivery on time

6.Accept small quantity orders



Looking for ideal Resin Bond Dicing Blade Manufacturer & supplier ? We have a wide selection at great prices to help you get creative. All the 1A8 Resin Bond Dicing Blade for Semiconductor are quality guaranteed. We are China Origin Factory of Diamond Cutting Wheel. If you have any question, please feel free to contact us.

Product Categories : Sail Blade Series > Sail Series BIA Resin Bonded Blade

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  • 1A8 Resin Bond Dicing Blade
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