Company Details

  • Suzhou Sail Science & Technology Co., Ltd.

  •  [Jiangsu,China]
  • Business Type:Manufacturer
  • Main Mark: Americas , Asia , Europe , North Europe , Worldwide
  • Exporter:51% - 60%
  • Certs:ISO9001
  • Description:Electroformed Hubless Diamond Blade,Hubless Diamond Blades,Hubless Diamond Blade for BGA
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Suzhou Sail Science & Technology Co., Ltd.

Electroformed Hubless Diamond Blade,Hubless Diamond Blades,Hubless Diamond Blade for BGA

Home > Products > The Blade Series > The Hubless Nickel Dicing Blade > Electroformed Hubless Diamond Blade

Electroformed Hubless Diamond Blade

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    Payment Type: L/C,T/T
    Incoterm: FOB,CIF,CPT
    Min. Order: 100 Bag/Bags
    Delivery Time: 20 Days

Basic Info

Model No.: BTNBC06

Material: Diamond

Abrasive: Superabrasive

Shapes: Edge Shape

Types: Cutting Wheel

Cylindricity: <0.02

Circular Degree: <0.01

Technics: Electroplating

Working Style: Cutting

Additional Info

Packaging: Bags or Cartons

Productivity:  1200PCS PER MONTH


Transportation: Ocean,Air


Supply Ability: 300PCS PER WEEK

Certificate: ISO9001:2008

HS Code: 8202391000

Port: Shanghai Airport,Shanghai Seaport

Product Description

Suzhou Sail technology co., LTD uses the advanced electroplating process and unique diamond dispersion technology, can make The Hub Blade of different specifications . hardness and concentration, the different craft and formula are used for different customers. We can effectively improve the quality and life of the dicing blade under the premise of meet the requirements of customers cutting. The blades are main used for PCB.BGA.ceramic substrate materials and Silicon wafer of cutting and scribing.

These blades employ electroformed bonds that realize superb cutting quality and blade life.In addition to dicing semiconductor wafers, these blades are suitable for dicing a wide variety of semiconductor packages.


1. Deep cutting and grooving are possible using ultra-thin blades.

2. Blade thickness 0.015 mm to 0.3 mm.

3. Wide range of grit sizes and bond types are available to meet application requirements.

4. Available for both dicing saws and slicers.

The blade Specifications:

The blade bond Abrasive Thehnics The blade thickness
Nickel Diamond Eletroplating 15~300μm
The blade precisiong Cutting material Abrasive size O.D.
5μm Silicon Ceramics CSP 400-3000# 55.56~60.00mm

The cutting parameters:

Spindle rate Feed speed cut depth
30~50K/min 10~80mm/s 0.5~1.0mm

Looking for ideal Electroformed Hubless Diamond Blade Manufacturer & supplier ? We have a wide selection at great prices to help you get creative. All the Hubless Diamond Blades are quality guaranteed. We are China Origin Factory of Hubless Diamond Blade for BGA. If you have any question, please feel free to contact us.

Product Categories : The Blade Series > The Hubless Nickel Dicing Blade

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  • Electroformed Hubless Diamond Blade
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