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Electroformed Hubless Diamond Blade

Basic Info

Model No.: BTNBC06

Product Description

Suzhou Sail technology co., LTD uses the advanced electroplating process and unique diamond dispersion technology, can make The Hub Blade of different specifications . hardness and concentration, the different craft and formula are used for different customers. We can effectively improve the quality and life of the dicing blade under the premise of meet the requirements of customers cutting. The blades are main used for PCB.BGA.ceramic substrate materials and Silicon wafer of cutting and scribing.

These blades employ electroformed bonds that realize superb cutting quality and blade life.In addition to dicing semiconductor wafers, these blades are suitable for dicing a wide variety of semiconductor packages.


1. Deep cutting and grooving are possible using ultra-thin blades.

2. Blade thickness 0.015 mm to 0.3 mm.

3. Wide range of grit sizes and bond types are available to meet application requirements.

4. Available for both dicing saws and slicers.

The blade Specifications:

The blade bond Abrasive Thehnics The blade thickness
Nickel Diamond Eletroplating 15~300μm
The blade precisiong Cutting material Abrasive size O.D.
5μm Silicon Ceramics CSP 400-3000# 55.56~60.00mm

The cutting parameters:

Spindle rate Feed speed cut depth
30~50K/min 10~80mm/s 0.5~1.0mm

Contact us if you need more details on Electroformed Hubless Diamond Blade. We are ready to answer your questions on packaging, logistics, certification or any other aspects about Hubless Diamond Blades、Hubless Diamond Blade for BGA. If these products fail to match your need, please contact us and we would like to provide relevant information.

Product Categories : The Blade Series > The Hubless Nickel Dicing Blade

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