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The Hubless Nickel Dicing Blade for Substrates

Product Description

The series developed for dicing various substrates adopts a larger grit size compared to the hub blades for semiconductor wafers. Also, the abundant concentration lineup responds to various customer requests.


1. High processing quality for cutting of hard, brittle materials

2.High-speed processing of hard, brittle materials is possible
Selectable from a lineup with an abundant variety of grit sizes and concentrations.

4.Reduction in resin/metal burring by selecting a low concentration.

The blade Specifications:

The blade bond Abrasive Thehnics The blade thickness
Nickel Diamond Eletroplating 100~300μm
The blade precisiong Cutting material Abrasive size O.D.
10μm LED CSP 400~600# 56.00~60.00mm

Slotting specification:

Number Width(mm) Depth(mm)
8 0.5 1
16 1 2
32 1.2 3

he cutting parameters:

Spindle rate Feed speed cut depth
30~50K/min 10~40mm/s 1.0~2.0mm

Contact us if you need more details on The Cutting of Substrates Blade. We are ready to answer your questions on packaging, logistics, certification or any other aspects about Reduction in Resin/Metal Burring、The Abrasive Grain Size. If these products fail to match your need, please contact us and we would like to provide relevant information.

Product Categories : The Blade Series > The Hubless Nickel Dicing Blade

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