The series developed for dicing various substrates adopts a larger grit size compared to the hub blades for semiconductor wafers. Also, the abundant concentration lineup responds to various customer requests.
1. High processing quality for cutting of hard, brittle materials
2.High-speed processing of hard, brittle materials is possible
3.Selectable from a lineup with an abundant variety of grit sizes and concentrations.
4.Reduction in resin/metal burring by selecting a low concentration.
The blade Specifications:
|The blade bond||Abrasive||Thehnics||The blade thickness|
|The blade precisiong||Cutting material||Abrasive size||O.D.|
|64|| || |
he cutting parameters:
|Spindle rate||Feed speed||cut depth|
|30~50K/min||10~40mm/s|| 1.0~2.0mm |