The Hubless Nickel Dicing Blade for Substrates
Product Description
The series developed for dicing various substrates adopts a larger grit size compared to the hub blades for semiconductor wafers. Also, the abundant concentration lineup responds to various customer requests.
Features:
1. High processing quality for cutting of hard, brittle materials
2.High-speed processing of hard, brittle materials is possible
3.Selectable from a lineup with an abundant variety of grit sizes and concentrations.
4.Reduction in resin/metal burring by selecting a low concentration.
The blade Specifications:
| The blade bond | Abrasive | Thehnics | The blade thickness |
| Nickel | Diamond | Eletroplating | 100~300μm |
| The blade precisiong | Cutting material | Abrasive size | O.D. |
| 10μm | LED CSP | 400~600# | 56.00~60.00mm |
Slotting specification:
| Number | Width(mm) | Depth(mm) |
| 8 | 0.5 | 1 |
| 16 | 1 | 2 |
| 32 | 1.2 | 3 |
| 64 | | |
he cutting parameters:
| Spindle rate | Feed speed | cut depth |
| 30~50K/min | 10~40mm/s | 1.0~2.0mm |
Product Categories : The Blade Series > The Hubless Nickel Dicing Blade
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