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The Hubless Nickel Dicing Blade for PCB

Product Description

THis series blade is designed for the Printed Circuit Board material. Provide different diamond concentration for client to chooes, In processing hard and brittle materials, process quality is improved while blade life is maintained.


1. 5 diamond concentration levels support diverse applications.

2. The Series offers shorter precut times and lower chance of blade breakage due to flying die.

3. The blade have a long life for Printed Circuit Board material.

The blade Specifications:

The blade bond Abrasive Thehnics The blade thickness
Nickel Diamond Eletroplating 100~200μm
The blade precisiong Cutting material Abrasive size O.D.
2μm PCB 600~3000# 54~58mm

Slotting specification:

Number Width(mm) Depth(mm)
8 0.5 1
16 1 2
32 1.2 3

The cutting parameters:

Spindle rate Feed speed cut depth
30~50K/min 10~80mm/s 0.5~1.0mm

Contact us if you need more details on The Printed Circuit Board Cutting. We are ready to answer your questions on packaging, logistics, certification or any other aspects about The Hubless Blade for PCB、The Myriametre Cutting Blade. If these products fail to match your need, please contact us and we would like to provide relevant information.

Product Categories : The Blade Series > The Hubless Nickel Dicing Blade

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