Company Details

  • Suzhou Sail Science & Technology Co., Ltd.

  •  [Jiangsu,China]
  • Business Type:Manufacturer
  • Main Mark: Americas , Asia , Europe , North Europe , Worldwide
  • Exporter:51% - 60%
  • Certs:ISO9001
  • Description:1A8 Resin Bond Diamond Cutting Blade For Semiconductor,Super Resin Bond Dicing Blade,Dicing Blade
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Suzhou Sail Science & Technology Co., Ltd.

1A8 Resin Bond Diamond Cutting Blade For Semiconductor,Super Resin Bond Dicing Blade,Dicing Blade

Home > Products > The Blade Series > Resin Bond Blade > 1A8 Resin Bond Diamond Cutting Blade For Semiconductor

1A8 Resin Bond Diamond Cutting Blade For Semiconductor

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    Payment Type: T/T
    Incoterm: FOB,CIP
    Min. Order: 30 Bag/Bags
    Delivery Time: 10 Days

Basic Info

Model No.: B1V8SDC280L125

Material: Diamond

Abrasive: Superabrasive

Shapes: Section Shape

Types: Cutting Wheel

Grain Size: 280#

Cylindricity: <0.02

Circular Degree: <0.01

Technics: Sinter

Working Style: Cutting

Type: 1V8

Diamond: SDC

Grit: 280#

OD: L

Concentration: 1025

Oueter Dameter: 56mm

Thickness: 0.32mm

Inner Diameter: 40mm

Additional Info

Packaging: bags and carton

Transportation: Air

Port: Shanghai Airport

Product Description

Resin Bond Blade has rich elasticity and good self-sharpening,resin bond blade is widely used in sigulation field of semiconductor packing meterials and optical materials.A series of bonds in our company can meet different cutting requirements.What's more,we can provide customers service for different specifications and types according their needs.

Features:

1. High accurace

2. Long life span

3. Strong hold of grits

4. Slight cutting depth

5. Good wear resistance

6. Good shape keeping ability

Cutting conditons

Spindle speed

25-30K RPM

Feed Speed

120mm/sec

Depth into UV tape

50um

Specifications

Shape

Shape

1A8

Specification

Grit type

Grite size

Concentration

Bond

SDC

180


BF813


Grit Type

SD

Standard grit

SDC

Coating grit


Mesh Size

Mesh size

SD

SDC

180

ok

220

ok

240

ok

320

ok

400

ok

ok

500

ok

ok

600

ok

ok

8000

ok

ok

Looking for ideal 1A8 Resin Bond Diamond Cutting Blade For Semiconductor Manufacturer & supplier ? We have a wide selection at great prices to help you get creative. All the Super Resin Bond Dicing Blade are quality guaranteed. We are China Origin Factory of Dicing Blade. If you have any question, please feel free to contact us.

Product Categories : The Blade Series > Resin Bond Blade

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  • 1A8 Resin Bond Diamond Cutting Blade For Semiconductor
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