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Stable dicing for DFN

Product Description

This series blade is designed for cutting DFN material. By increasing the bond sharpness, the blade realize stable and high quality processing.


1.Providing cutting solution according to customer material.

2. Reducing the chipping problem.

3.Improving the cutting quality.

4.This blade has very good wear resistance.

The blade Specifications:

The blade bond Abrasive Thehnics The blade thickness
Resin Diamond Sintering 0.28-0.33mm
The blade precisiong Cutting material Abrasive size O.D.
6μm DFN 200~1000# 55.56~60.00mm

Abrasive specification:

Abrasive SD SDC
Concentration 50-100% 50-100%
Grits Size 180-400# 180-800%

The cutting parameters:

Spindle rate Feed speed cut depth
21~25K/min 30~50mm/s 0.3~1.2mm

Contact us if you need more details on Stable Cutting for DFN. We are ready to answer your questions on packaging, logistics, certification or any other aspects about Limited Back Chiping for DFN、Stable Dicing Blades for DFN. If these products fail to match your need, please contact us and we would like to provide relevant information.

Product Categories : The Blade Series > Resin Bond Blade

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