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Resin Bond Dicing Blade

Basic Info

Model No.: B1A8SDC170N100BF401

Product Description

Resin Bond Blade has rich elasticity and good self-sharpening,resin bond blade is widely used in sigulation field of semiconductor packing meterials and optical materials.A series of bonds in our company can meet different cutting requirements.What's more,we can provide customers service for different specifications and types according their needs.

Features:

1. High accurace

2. Long life span

3. Strong hold of grits

4. Slight cutting depth

5. Good wear resistance

6. Good shape keeping ability

Cutting conditons

Spindle speed

25-30K RPM

Feed Speed

120mm/sec

Depth into UV tape

50um

Specifications

Shape

Shape

1A8

Specification

Grit type

Grite size

Concentration

Bond

SDC

180


BF813


Grit Type

SD

Standard grit

SDC

Coating grit


Mesh Size

Mesh size

SD

SDC

180

ok

220

ok

240

ok

320

ok

400

ok

ok

500

ok

ok

600

ok

ok

8000

ok

ok

Contact us if you need more details on Ultra-thin Resin Bond Dicing Blade. We are ready to answer your questions on packaging, logistics, certification or any other aspects about Resinoid Bonded Grinding Wheels、Resin Metal Sintered Blades. If these products fail to match your need, please contact us and we would like to provide relevant information.

Product Categories : The Blade Series > Resin Bond Blade

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