Metal Edge Grinding Wheel

Metal Edge Grinding Wheel

Metal Edge Grinding Wheel are porous,which mainly used for back thinning of wafer.This Kind of Grinding Wheels also have a long life and high-speeding .

Feature:

l Porous

l High-speed(V_max=500μm/min)

l Long life and good quality

l Offer variety of special requirements.

Material of workpieces:

Discrete device ,silicon wafer

Contact us if you need more details on The Vitrified-bond Wheels. We are ready to answer your questions on packaging, logistics, certification or any other aspects about Diamond Dicing Blade、Grinding Wheels for Silicon Wafer. If these products fail to match your need, please contact us and we would like to provide relevant information.

Product Categories : Sail Grinding Wheel Series > Sail Vitrified-bond Griding Wheels