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Home > Products > The Blade Series > Metal-Bond Dicing Blade > 70μm Ultra-thin Diamond Dicing-Blade

70μm Ultra-thin Diamond Dicing-Blade

Basic Info

Model No.: MR0209D

Product Description

It is available for the application that is wide from brittle materials such as glass or the Ceramics to semiconductor packages such as CSP or QFN by an abundant bond lineup,especially for WLCSP cutting. In addition, the sharpness and balance of the life provide the product which they got by intensive degree control a high particle size.

Features:

Metal bond Diamond Saw Blade has the following features:

1.These products ahow very attractive operational properties including high cutting alility.

2.high wear resistance, long life, high geometrical precision of working and fixing parts.
3.good fracture resistance and high grinding quality.

Cutting conditons:

Spindle speed 25-30K RPM
Feed Speed 8mm/sec
Depth into UV tape 40um

Specifications:

Shape

Shape
1A8
Specification

Grit type Grite size Concentration Bond
SD 800 25 MR0209D

Grit Type

SD Standard grit
SDC Coating grit

Mesh Size

Mesh size SD SDC
4000 ok
2500 ok

2000 ok

1500 ok

1200 ok
ok
1000 ok
ok
900 ok
ok
800 ok
ok
700 ok
ok
600 ok
ok
500 ok
ok
400 ok
ok
320 ok
ok

Dimension

O.D.
Blade thickness
I.D.
52 0.07 40


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Product Categories : The Blade Series > Metal-Bond Dicing Blade

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