Metal-Bond Diamond Dicing Blade

Metal bond high precision dicing blade without steel core is made of identical material, with thin thickness and high precision, They are mainly used for grooving and cutting with high accuracy and slight cutting depth,High sintering technologies bring out the properties to correspond to the various applications.A unique manufacturing processes offer the even distribution of the grit and performance stability.Improved the high cutting ability and wear resistance using the special grit.
Suit for:
1.Semiconductor, such as BGA, LGA, LED, diode, etc.
2. Optical Glass, such as filter, blue glass, crystal, gem, etc.
3. Optical communication, such as V-shape slotting on quartz and cutting quartz cover;
4. Other materials, such as magnetic materials, carbide, tool steel, stainless steel, etc
Cutting conditons

Spindle speed	25-30K RPM
Feed Speed	5-8mm/sec
Depth into UV tape	40um

SpecificationS

Shape

Shape

1A8

Specification

Grit type	Grite size	Concentration	Bond
SD	800	25	MS09T1H

Grit Type

SD	Standard grit
SDC	Coating grit

Mesh Size

Mesh size	SD	SDC
4000	ok
2500	ok
2000	ok
1500	ok
1200	ok	ok
1000	ok	ok
900	ok	ok
800	ok	ok
700	ok	ok
600	ok	ok
500	ok	ok
400	ok	ok
320	ok	ok

Dimension

O.D.	Blade thickness	I.D.
58	0.15	40

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Product Categories : The Blade Series > Metal-Bond Dicing Blade