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Home > Products > The Blade Series > Metal-Bond Dicing Blade > Ultra Thin Diamond Discs

Basic Info

Material: Diamond

Abrasive: Superabrasive

Shapes: Edge Shape

Types: Cutting Wheel

Grain Size: 280#

Cylindricity: <1

Circular Degree: <1

Technics: Electroplating

Working Style: Cutting

Product Name: Resin-bond Grinding Wheels

Diamond: SD

Particle Size: 2000#


Concentration: 100%

Bond: RB05

Outerside Diameter: 750D


Thickness: 0.09

Product Description

We produce Ultra Precision diamond and CBN grinding wheel

They are suitable for: High-tech electronic parts and related products such as magnetic head, IC, LSI, optical fiber, semiconductor, electronic lead frame and etc, require high precision disc wheel with high precision, efficiency Cutting, Slicing, Wafering, Grooving, Slotting, Cross Sectioning, Gang Sawing, Slabbing etc

Available for the materials:
All kinds of resin materials used in Electronic and Optical fiels, Quartz, Glass, Ceramic, Yag, Sapphire, Agate, Granite, Marble etc

Ultra Precision: Size precision can reach 0.002mm
High Rigity: Good rigidity prevent the operation from slant and vibration
Long life Time: New technology keeps the discs's long life
Usage in Group: 10 or 12 in group makes high efficient operation

Metal-bond blade

Contact us if you need more details on Ultra Precision Diamond Discs. We are ready to answer your questions on packaging, logistics, certification or any other aspects about Metal Bonded Dicing Blades、The Metal Sintered Ultra Thin and Precision Diamond Blade. If these products fail to match your need, please contact us and we would like to provide relevant information.

Product Categories : The Blade Series > Metal-Bond Dicing Blade

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