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Home > Products > The Blade Series > Metal-Bond Dicing Blade > High Precision blade Cutting Sapphire Crystal

High Precision blade Cutting Sapphire Crystal

Basic Info

Model No.: MS09t2H

Product Description

The metal sintered ultra thin and precision Diamond Blade is with the speciality of strong-hold grains and exellent wearability. It fits to be used for the cutting and grooving of electronic and optical materials, also could be used for the cutting and grooving of ceramic and Semiconductor Materials with its good rigidity.

Features:

1. Grinding efficiently, good wear resistance,
2.small grinding force, low grinding temperature
3.good quality of processing.
4.best diamond material
5.Used for sharpening, grinding, abrasive

Cutting conditons

Spindle speed 17-20K RPM
Feed Speed 5mm/sec
sapphire crystal
0.3mm

Specifications

Shape

Shape
1A8
Specification

Grit type Grite size Concentration Bond
SD 1000 25 MS09T2H

Grit Type

SD Standard grit
SDC Coating grit

Mesh Size

Mesh size SD SDC
4000 ok
2500 ok

2000 ok

1500 ok

1200 ok
ok
1000 ok
ok
900 ok
ok
800 ok
ok
700 ok
ok
600 ok
ok
500 ok
ok
400 ok
ok
320 ok
ok

Dimension

O.D.
Blade thickness
I.D.
53 0.1 40
D.D.(mm) Blade thickness(mm)
I.D
Availability size Tolerance Availabiility size Tolerance Availabiility size
Tolerance
50-100 +0.05/-0 0.05-0.5 ±0.005 25.4-88.9 H6



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Product Categories : The Blade Series > Metal-Bond Dicing Blade

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