Find CNC Diamond Grinding Wheel, Back Side Chipping, Dicing Saw For For Cutting Wlcsp on Industry Directory, Reliable Manufacturer/Supplier/Factory from China.

Basic Info

Model No.: SD1000

Type: Die Grinder

Power Source: Electricity

Object: Turning Tool

Application: Construction

Disc(Wheel) Type: Grinding Disc

Material: Metal

Working Style: High-speed universal

Disc Diameter: 230mm

Variable Speed: With Variable Speed

Product Name: Back Drinding Wheel

Applications: Silicon Wafer

Abrasive: SD Synthetic

Grit: 270-8000

Bond: Metal,Vitrified,Resin

OD: 200~304

Width: 2-7MM

Product Description

Advantage:

Minimized wafer edge chipping/improved die strength,Excellent grinding ablity with high feed/Applicable thin wafer


Sail series Grinding Wheels employ a new porous vitrified bond with excellent swarf removal capability as well, the new bond feeds in the wheel coolant water in order to grind extremely hard SiC wafers. Grinding with a fixed abrasive produces a surface roughness approaching a polish. Grinding can be performed on tape mounted wafers making it unnecessary to use wafer carriers. The total process is much easier compared to a slurry processes

High-Quality-Diamond-Back-Grinding-Wheel-For

Sail series grinding wheels

1. excllent quality.

2, steady working
3. long life time.
4. high performance

Specification:




Contact us if you need more details on Back Grinding Wheel for Sapphire. We are ready to answer your questions on packaging, logistics, certification or any other aspects about Back Grinding Wheel for LED、Metal Edge Grinding Wheels. If these products fail to match your need, please contact us and we would like to provide relevant information.

Product Categories : Abrasion Wheels > Back Grinding Diamond Wheels

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