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Home > Products > Abrasion Wheels > Back Grinding Diamond Wheels > Resin Bonded Grinding Discs

Resin Bonded Grinding Discs

Packaging: 
Carton package for small size wheel Carton+plastic foam for big size wheel
Productivity: 
1200PCS PER MONTH
Brand: 
SAIL-TECH
Place of Origin: 
SUZHOU INDUSTRIAL PARK
Supply Ability: 
300PCS PER WEEK
Certificate: 
ISO9001:2008
HS Code: 
8208101900
Port: 
Shangahi Airport or Shnaghai Port,Shanghai Airport

Basic Info

Type: Die Grinder

Power Source: Electricity

Object: Turning Tool

Application: Construction

Disc(Wheel) Type: Grinding Disc

Material: Metal

Working Style: High-speed universal

Disc Diameter: 230mm

Variable Speed: With Variable Speed

No: None

Product Description

The Grinding Wheels for LED substrate are mainly used for back thinning of sapphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer.
Workpiece processed: sapphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer.
Material of workpiece: synthetic sapphire, single crystal silicon, gallium arsenide and GaN materials.
Grinders: SHUWA SGM-6301, NTS Nanosurface-180G, NTS Nanosurface 250/NC-VDM

485189214_653

6A2T grinding wheels

Features:

1.Be used with Japanese, German, American, Korea and Chinese grinders
2.Superior grinding performance
3.High cost performance



Specfication:

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Contact us if you need more details on Back Grinding Wheels for GaN Wafer. We are ready to answer your questions on packaging, logistics, certification or any other aspects about Back Grinding Wheels for Sapphire、Back Grinding Wheels for GaAs. If these products fail to match your need, please contact us and we would like to provide relevant information.

Product Categories : Abrasion Wheels > Back Grinding Diamond Wheels

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