Model No.: SW01
Shapes: Edge Shape
Types: Surface Grinding Wheel
Grain Size: 280#
Circular Degree: <1
Working Style: Cutting
Packaging: Bags or Cartons
Productivity: 1200PCS PER MONTH
Place of Origin: SUZHOU INDUSTRIAL PARK
Supply Ability: 300PCS PER WEEK
HS Code: 8202391000
Port: Shanghai Airport,Shanghai Seaport
Silicon Grinding Wheels are mainly used for the thinning and fine grinding of the silicon wafer. These products were produced by our company, which possess superior grinding performance and high cost performance, are among the top level worldwide. They are usually used for back thinning, grinding and fine grinding of monocrystalline silicon and some other Semiconductor Materials.
Good self-sharpening performance and good elasticity
High grinding efficiency and low grinding temperature
High processing precision and good surface quality
Silicon wafers Sapphire GaN GaAs
SD 1000- N 50- RB05
diamond particle size hardness concentration bond
200D- 3W- 5T
Outside diameter Thickness Height
Looking for ideal Silicon Wafer Back & Front Wheel Manufacturer & supplier ? We have a wide selection at great prices to help you get creative. All the Grinding Wheel for Silicon Wafer are quality guaranteed. We are China Origin Factory of Silicon Wafer Back and Front Thining. If you have any question, please feel free to contact us.
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