Model No.: SW01
Shapes: Edge Shape
Types: Surface Grinding Wheel
Grain Size: 280#
Circular Degree: <1
Working Style: Cutting
Silicon Grinding Wheels are mainly used for the thinning and fine grinding of the silicon wafer. These products were produced by our company, which possess superior grinding performance and high cost performance, are among the top level worldwide. They are usually used for back thinning, grinding and fine grinding of monocrystalline silicon and some other Semiconductor Materials.
Good self-sharpening performance and good elasticity
High grinding efficiency and low grinding temperature
High processing precision and good surface quality
Silicon wafers Sapphire GaN GaAs
SD 1000- N 50- RB05
diamond particle size hardness concentration bond
200D- 3W- 5T
Outside diameter Thickness Height
Contact us if you need more details on Silicon Wafer Back & Front Wheel. We are ready to answer your questions on packaging, logistics, certification or any other aspects about Grinding Wheel for Silicon Wafer、Silicon Wafer Back and Front Thining. If these products fail to match your need, please contact us and we would like to provide relevant information.