Find CNC Diamond Grinding Wheel, Back Side Chipping, Dicing Saw For For Cutting Wlcsp on Industry Directory, Reliable Manufacturer/Supplier/Factory from China.

Home > Products > Abrasion Wheels > Back Grinding Diamond Wheels > Silicon Wafer back & front wheel

Basic Info

Model No.: SW01

Material: Diamond

Abrasive: Superabrasive

Shapes: Edge Shape

Types: Surface Grinding Wheel

Grain Size: 280#

Cylindricity: <1

Circular Degree: <1

Technics: Sinter

Working Style: Cutting

Product Description


Silicon Grinding Wheels are mainly used for the thinning and fine grinding of the silicon wafer. These products were produced by our company, which possess superior grinding performance and high cost performance, are among the top level worldwide. They are usually used for back thinning, grinding and fine grinding of monocrystalline silicon and some other Semiconductor Materials.

Characters

Good self-sharpening performance and good elasticity

High grinding efficiency and low grinding temperature

High processing precision and good surface quality

Silicon wafers Sapphire GaN GaAs

SD 1000- N 50- RB05

diamond particle size hardness concentration bond

200D- 3W- 5T

Outside diameter Thickness Height

wheel

Contact us if you need more details on Silicon Wafer Back & Front Wheel. We are ready to answer your questions on packaging, logistics, certification or any other aspects about Grinding Wheel for Silicon Wafer、Silicon Wafer Back and Front Thining. If these products fail to match your need, please contact us and we would like to provide relevant information.

Product Categories : Abrasion Wheels > Back Grinding Diamond Wheels

Email to this supplier
  • *Subject:
  • To:

  • *Messages:
    Your message must be between 20-8000 characters