Silicon Wafer back & front wheel
Basic Info
Model No.: SW01
Product Description
Silicon Grinding Wheels are mainly used for the thinning and fine grinding of the silicon wafer. These products were produced by our company, which possess superior grinding performance and high cost performance, are among the top level worldwide. They are usually used for back thinning, grinding and fine grinding of monocrystalline silicon and some other Semiconductor Materials.
Characters
Good self-sharpening performance and good elasticity
High grinding efficiency and low grinding temperature
High processing precision and good surface quality
Silicon wafers Sapphire GaN GaAs
SD 1000- N 50- RB05
diamond particle size hardness concentration bond
200D- 3W- 5T
Outside diameter Thickness Height
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Product Categories : Abrasion Wheels > Back Grinding Diamond Wheels
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