Find CNC Diamond Grinding Wheel, Back Side Chipping, Dicing Saw For For Cutting Wlcsp on Industry Directory, Reliable Manufacturer/Supplier/Factory from China.

Basic Info

Type: Die Grinder

Power Source: Electricity

Object: Turning Tool

Application: Construction

Disc(Wheel) Type: Grinding Disc

Material: Metal

Working Style: High-speed universal

Disc Diameter: 230mm

Variable Speed: With Variable Speed

No: None

Product Description

MS series Grinding Wheels employ a new porous vitrified bond with excellent swarf removal capability as well, the new bond feeds in the wheel coolant water in order to grind extremely hard SiC wafers. Grinding with a fixed abrasive produces a surface roughness approaching a polish. Grinding can be performed on tape mounted wafers making it unnecessary to use wafer carriers. The total process is much easier compared to a slurry processes

High-Quality-Diamond-Back-Grinding-Wheel-For

MS series grinding wheels

1. excllent quality.

2, steady working
3. long life time.
4. high performance

Specification:

515926569_930


515926570_829

Contact us if you need more details on Back Grinding Wheels. We are ready to answer your questions on packaging, logistics, certification or any other aspects about Wheels for SiC Wafers、Diamond Grinding Cup-Wheels with Aluminium. If these products fail to match your need, please contact us and we would like to provide relevant information.

Product Categories : Abrasion Wheels > Back Grinding Diamond Wheels

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