Type: Die Grinder
Power Source: Electricity
Object: Turning Tool
Disc(Wheel) Type: Grinding Disc
Working Style: High-speed universal
Disc Diameter: 230mm
Variable Speed: With Variable Speed
MS series Grinding Wheels employ a new porous vitrified bond with excellent swarf removal capability as well, the new bond feeds in the wheel coolant water in order to grind extremely hard SiC wafers. Grinding with a fixed abrasive produces a surface roughness approaching a polish. Grinding can be performed on tape mounted wafers making it unnecessary to use wafer carriers. The total process is much easier compared to a slurry processes
MS series grinding wheels
1. excllent quality.
2, steady working
3. long life time.
4. high performance
Looking for ideal Back Grinding Wheels Manufacturer & supplier ? We have a wide selection at great prices to help you get creative. All the Wheels for SiC Wafers are quality guaranteed. We are China Origin Factory of Diamond Grinding Cup-Wheels with Aluminium. If you have any question, please feel free to contact us.
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