Type: Die Grinder
Power Source: Electricity
Object: Turning Tool
Disc(Wheel) Type: Grinding Disc
Working Style: High-speed universal
Disc Diameter: 230mm
Variable Speed: With Variable Speed
MS series Grinding Wheels employ a new porous vitrified bond with excellent swarf removal capability as well, the new bond feeds in the wheel coolant water in order to grind extremely hard SiC wafers. Grinding with a fixed abrasive produces a surface roughness approaching a polish. Grinding can be performed on tape mounted wafers making it unnecessary to use wafer carriers. The total process is much easier compared to a slurry processes
MS series grinding wheels
1. excllent quality.
2, steady working
3. long life time.
4. high performance
Contact us if you need more details on Back Grinding Wheels. We are ready to answer your questions on packaging, logistics, certification or any other aspects about Wheels for SiC Wafers、Diamond Grinding Cup-Wheels with Aluminium. If these products fail to match your need, please contact us and we would like to provide relevant information.