Resin bond blade For DFN Materials
Basic Info
Model No.: SB1N8
Product Description
Resin Bond Blade has rich elasticity and good self-sharpening,resin bond blade is widely used in sigulation field of semiconductor packing meterials and optical materials.A series of bonds in our company can meet different cutting requirements.What's more,we can provide customers service for different specifications and types according their needs.
Features:
1. High accurace
2. Long life span
3. Strong hold of grits
4. Slight cutting depth
5. Good wear resistance
6. Good shape keeping ability
Contact us if you need more details on Resin Bond Blade for DFN Materials. We are ready to answer your questions on packaging, logistics, certification or any other aspects about DFN Materials Resin Bond Blade、Super Resin Bond Blade. If these products fail to match your need, please contact us and we would like to provide relevant information.Product Categories : Sail Blade Series > Sail Series BIA Resin Bonded Blade
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